Cooling systems for electrical equipment

ABSTRACT

A space-saving, high-density modular data center and an energy-efficient cooling system for a modular data center are disclosed. The modular data center includes a first cooling circuit including a primary cooling device and a plurality of modular data pods. Each modular data pod includes a plurality of servers, a heat exchange member coupled to the first cooling circuit and a second cooling circuit coupled to the heat exchange member and configured to cool the plurality of servers, the second cooling circuit including a secondary cooling device configured to cool fluid flowing through the second cooling circuit. Each modular data pod also includes an auxiliary enclosure containing at least a portion of a distributed mechanical cooling system, which is configured to trim the cooling performed by a central free-cooling system.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.13/338,987, which was filed on Dec. 28, 2011, now U.S. Pat. No.8,254,124 issued on Aug. 28, 2012, which is a continuation-in-part ofinternational application no. PCT/US2011/41710, which was filed on Jun.23, 2011, now WO 2011/163532 A2, published on Dec. 29, 2011, and claimsthe benefit of, and priority to, U.S. Provisional Application Ser. No.61/357,851, which was filed on Jun. 23, 2010; U.S. ProvisionalApplication Ser. No. 61/414,279, which was filed on Nov. 16, 2010; U.S.Provisional Application Ser. No. 61/448,631, which was filed on Mar. 2,2011; and U.S. Provisional Application Ser. No. 61/482,070, which wasfiled on May 3, 2011, the entire contents of each of which are herebyincorporated by reference herein.

BACKGROUND

1. Technical Field

The present disclosure generally relates to computing data centers. Moreparticularly, the present disclosure relates to space-savinghigh-density modular data pod systems and energy-efficient coolingsystems for modular data pod systems.

2. Background of Related Art

Traditionally, large data centers rely on large, oversized coolinginfrastructures, including chilled water systems, chiller plants, anddirect expansion cooling systems, to maintain their operatingtemperatures. There are many problems associated with the large,oversized cooling infrastructures for large data centers, including highinitial capital, operation, and maintenance costs. For instance, atraditional chiller plant may require approximately 280 tons of chillercapacity to support a large data center having a power consumptioncapacity of 1 MW. Further, the traditional chiller plant is typicallydesigned to cool the entire data center, as opposed to a few selectedareas within the data center. As a result, the traditional chiller plantspends a considerable amount of energy on areas that do not need to becooled. Further, one of the design constraints used to implement thetraditional chiller plant is the power consumption capacity of theentire data center. For that reason, if the data center does not run atits power consumption capacity due to load fluctuations, the efficiencyof the traditional chiller plant drops significantly.

Several cooling systems exist in the market having a more modular designthan the traditional large, oversized cooling infrastructures that allowthem to cool selected areas of a large data center at a reduced cost.For instance, an air-cooled “free cooling” system (also referred to as astraight air-cooled system) uses ambient air as a medium to cool serverracks or containers of server racks in a large data center. However, oneof the drawbacks of the air-cooled “free cooling” system is that itoperates only in a cool, dry-climate environment thereby restricting itsuse to limited geographical areas in the world.

An adiabatic-assisted system is another cooling system that rivals thetraditional large, oversized cooling electrical infrastructures. Theadiabatic-assisted system is a cooling system assisted by adiabaticwater having a more expanded geographical reach than the air-cooled“free cooling” system. However, the adiabatic-assisted system hascertain cooling tolerance limitations and is incapable of providingsufficient cooling to high density data centers, e.g., data centershaving IT rack loads of about 40 kW per IT rack.

SUMMARY

The embodiments of the modular data pod systems and associated coolingsystems of the present disclosure provide significant improvements andadvantages over traditional data centers and their cooling systemsincluding (1) a lower cost per kilowatt (kW) to build, deploy, andoperate a data center, (2) faster deployment than stick-builtconstruction, (3) more easily restacked and redeployed to allow the datacenter to keep up with new technological advances in server technology,(4) expandability, (5) compatibility with very high efficiency systemsto gain the highest power use efficiency (PUE) factor, (6) space savingand efficient in their space requirements allowing for higher densitycapabilities (i.e., more kilowatts per square foot), (7) scalability,(8) efficiency in mechanical cooling, (9) multi-use characteristics forsingle deployment, large indoor warehousing, or large outdoorapplications, such as data center farms, (10) energy efficiency in thecontainment of hot and cold aisles, (11) flexibility in their use ofdifferent types of cooling systems, and (12) capability of beingmodified to meet data center tier requirements for redundancy.

In one aspect, the present disclosure relates to a cooling system forelectrical equipment that includes a first cooling circuit including aprimary cooling device, a heat exchange member coupled to the firstcooling circuit, and a second cooling circuit coupled to the heatexchange member and configured to cool the electrical equipment. Thesecond cooling circuit includes a secondary cooling device configured tocool fluid flowing through the second cooling circuit. The secondarycooling device may cool a portion of a heat load associated with theelectrical equipment that the primary cooling device cannot cool or as afunction of the atmospheric conditions.

In another aspect, the present disclosure relates to a cooling systemthat includes a central cooling system, a heat exchange assembly coupledto the central cooling system and configured to cool electricalequipment, and a distributed cooling system coupled to the heat exchangeassembly. The central cooling system may be a free-cooling system.

BRIEF DESCRIPTION OF THE DRAWINGS

Various embodiments of the present disclosure are described withreference to the accompanying drawings wherein:

FIG. 1 is a schematic diagram of a modular data center according toembodiments of the present disclosure;

FIG. 2A is an illustration of a modular data pod having a pentagonalwall configuration according to one embodiment of the presentdisclosure;

FIG. 2B is an illustration of a modular data pod having a hexagonal wallconfiguration according to another embodiment of the present disclosure;

FIG. 2C is an illustration of a modular data pod having a heptagonalwall configuration according to yet another embodiment of the presentdisclosure;

FIG. 2D is an illustration of a modular data pod having an octagonalwall configuration according to yet another embodiment of the presentdisclosure;

FIG. 2E is an illustration of a modular data pod having a nonagonal wallconfiguration according to yet another embodiment of the presentdisclosure;

FIG. 2F is an illustration of a modular data pod having a decagonal wallconfiguration according to yet another embodiment of the presentdisclosure;

FIG. 2G is an illustration of the octagonal-shaped modular data pod ofFIG. 2D having two elongated walls forming a modular data pod accordingto another embodiment of the present disclosure;

FIG. 3 is an elevation view sectional side view) of a generic modulardata pod including a hot aisle and a cold aisle according to embodimentsof the present disclosure;

FIG. 4 is a plan view (i.e., sectional top view) of a modular data podshowing an upper coil deck according to embodiments of the presentdisclosure;

FIG. 5 is a plan view (i.e. sectional top view) of a modular data podshowing a ceiling fan assembly according to embodiments of the presentdisclosure;

FIG. 6 is a flow diagram for a close-coupled cooling system foroperation in high wet-bulb temperature applications according toembodiments of the present disclosure;

FIG. 7 is a schematic diagram of a refrigerant-cooled cooling systemthat includes the close-coupled cooling system of FIG. 6 for modulardata pods according to embodiments of the present disclosure;

FIG. 8 is a schematic diagram of a water-cooled air-conditioning systemthat includes an external chiller according to embodiments of thepresent disclosure;

FIG. 9 illustrates a modular data pod that includes a separate coolingcircuit that forms an “A-Frame” heat exchanger assembly according to oneembodiment of the present disclosure;

FIG. 10 is an upper plan view of the modular data pod of FIG. 9 thatincludes the separate cooling circuit that forms an “A-Frame” heatexchanger assembly according to one embodiment of the presentdisclosure;

FIG. 11 is a lower plan view of the modular data center pod assembly ofFIG. 10 illustrating forced-flow cooling devices that force airvertically through a sump below the central aisle of the modular datacenter pod assembly;

FIG. 12 is a schematic flow diagram of a cooling system for a datacenter assembly including a close-coupled cooling system according toembodiments of the present disclosure;

FIG. 13 is a schematic flow diagram of a close-coupled cooling systemthat can include the cooling system of FIG. 12 according to embodimentsof the present disclosure;

FIG. 14 is a schematic diagram of a water-cooled cooling system showingwater flow according to embodiments of the present disclosure;

FIG. 15 is a schematic diagram of a cooling system for low wet-bulbenvironments where high wet-bulb conditions may occasionally occur thatincludes a modular chiller according to embodiments of the presentdisclosure;

FIG. 16 is a schematic diagram of a portion of a water-cooled coolingsystem that includes an existing water cooling system showing water flowaccording to embodiments of the present disclosure;

FIG. 17 is a schematic diagram of a modular data pod farm illustratingstaged expansion of the data pod farm according to embodiments of thepresent disclosure;

FIG. 17A is detail of the modular data pod farm of FIG. 17 illustratingconnection of modular data pods into a plurality of modular data pods;

FIG. 17B is a simplified block diagram of the modular data farm of FIG.17 and of several pluralities of the plurality of modular data pods ofFIG. 17A illustrating staged expansion of the data pod farm according toembodiments of the present disclosure;

FIG. 18 is a schematic diagram of a modular data pod farm illustrating atransport system for modular data pods according to embodiments of thepresent disclosure.

FIG. 19 is a schematic diagram of a modular data pod farm illustratingthe removal of data pods according to embodiments of the presentdisclosure;

FIG. 20 is a schematic diagram of a modular data pod farm according toembodiments of the present disclosure;

FIGS. 21A-21C are flow diagrams of a method of cooling electronicequipment according to embodiments of the present disclosure;

FIGS. 22A-22C are flow diagrams of a method of deploying modular datapods of a modular data center according to embodiments of the presentdisclosure; and

FIGS. 22D-22E are flow diagrams of an alternative to the method ofdeploying modular data pods of a modular data center of FIGS. 22A-22Baccording to embodiments of the present disclosure.

DETAILED DESCRIPTION

Embodiments of the presently disclosed close-coupled cooling systems andmethods will now be described in detail with reference to the drawings,in which like reference numerals designate identical or correspondingelements in each of the several views.

The present disclosure relates to modular data pods and related supportsystems for providing energy-efficient, space-saving, and high-densityserver rack configurations. This modular approach allows for highlyefficient use of geometric shapes such as octagonal, hexagonal, andpentagonal shapes for creating a hot aisle and a cold aisle throughwhich air circulates for cooling the server racks. These polygonalshapes allow for maximum energy-efficiency and space-savings using thebenefits of both the interior and the exterior angles and sides. Theinterior pod shape provides a natural circular configuration forpositioning server racks. As compared to the prior art, thisconfiguration provides a more efficient way to create and contain a hotaisle and a cold aisle.

The cooling air, which is used to efficiently cool computer systems,such as data servers, follows a natural path which allows for naturalconvection. The natural convection is assisted by mechanical coolingsystems and components, e.g., fans, which are deployed in an efficientmanner. The exterior shape of the modular data pods allows for the mostefficient use of the space-saving characteristics of the multi-sided andangular geometric shapes of the modular data pods. The modular data podscan be deployed in tight groups similar to the patterns seen in beehives. Bee hives are considered to be the most efficient use of spaceknown to man. The space-saving, efficient design of the modular datapods accommodates the tremendous growth of the IT data storage industry.The completely modularized data pods also feature energy-efficientcooling systems and electrical, control, and IT systems for “just intime” deployment.

The close-coupled cooling systems and methods according to someembodiments of the present disclosure are “chiller-less” and requiresignificantly less mechanical refrigeration capacity than coolingsystems using chillers to handle the cooling of fluctuating IT loads. Insome embodiments, the system uses approximately 39-40 tons of subcoolingto accomplish the cooling of 1 megawatt of IT loading. This is based onproviding cooling in areas of relatively high wet-bulb conditions suchas the north east or southern hemispheres where wet-bulb conditions canbe extreme (e.g., wet-bulb temperatures of 78° F. and above). The systemcan be deployed in relatively high wet-bulb environmental areas wherechillers or direct expansion (DX) systems would have been normally beenmandatory.

An individual subcooling system can operate with close-coupled coolingat the individual point of loading to enable sufficient cooling tosupport IT rack inlet cooling temperatures (at the cold aisle) thatwould have normally required either DX or chiller assistance. The systemaccording to some embodiments of the present disclosure is used inclose-coupled applications such as modular data center applications. Inother embodiments, the cooling system can be used as a packaged systemto support modular cooling within a typical data center white space. Thesystem can significantly reduce the up front as well as the operationalcosts (e.g., energy costs) of data centers.

In some embodiments, the system can cool IT server racks using 72° F.refrigerant or higher as dictated by a particular project. This providescold aisle air temperatures or rack inlet temperatures of 75° F. orhigher as dictated by a particular project.

FIG. 1 is a schematic diagram of a data pod farm or modular data center1400. The data pod farm 1400 includes a data pod hive 1410. The term“hive” refers to a plurality of modular data pods coupled together andthe associated cooling infrastructure. The data pod hive 1410 includes aplurality of modular data pods 80 and 180 arranged in data pod chains122, 124, 126. The modular data pods 80 and 180 include a data enclosure85, which contains server racks, and an auxiliary enclosure 818, whichcontains cooling, power, and control circuitry.

The data pods 80 and 180 are coupled to a central cooling system 1420that includes central cooling, power, and control systems. The centralcooling system 1420 may form part of a Building Management System (BMS).The central cooling system 1420 includes a central cooling fluid circuit1430. The central cooling fluid circuit 1430 includes a first pair ofcooling towers 131 a, 131 b (also designated as CT-1A, CT-1B,respectively), a second pair of cooling towers 132 a, 132 b (alsodesignated as CT-2A, CT-2B, respectively), two banks of fluid pumps 146a, 146 b, a pair of supply lines 115 a, 115 b, and a pair of returnlines 125 a, 125 b.

The central cooling system 1420 also includes two banks of variablefrequency drives 144 a, 144 b, which drive respective banks of fluidpumps 146 a, 146 b. The central cooling system 1420 also includes twobanks of variable frequency drives 142 a, 142 h, which drive fans and/orfluid pumps within the two pairs of cooling towers 131 a, 131 h, 132 a,132 h. The data pod farm 1400 also includes a pair of central batterybackup units 150 a, 150 b that provide battery backup power to themodular data pods 80.

The data pod farm or modular data center 1400 and modular data pod hive1410 of FIG. 1 may be designed and deployed to support a large amount ofserver rack capacity (e.g., approximately 12-15 MW of server rackcapacity), FIG. 1 shows the space-saving attributes of the modular datapods geometric shape. A typical data center, which is non-modular,requires three to four times as much space to handle this level ofserver rack capacity and density.

The system infrastructure (the central cooling system 1420 and centralcooling fluid circuit 1430) is located at one end 1440 of the data podhive 1410 of the data pod farm 1400. FIG. 1 depicts an example of afull-hive deployment. Initially, however, a sufficient number of datapods 80 and 180 can be installed for early deployment. The number ofcooling towers, pumps, and electrical switch equipment can be deployedas needed on a just-in-time basis. Additional modular data pods 80 and180, including their auxiliary enclosures 818 and 818′, respectively,housing associated pipe and electrical chases, can also be deployed asneeded on a just-in-time basis. The installation of additional modulardata pods 80 and 180 and associated auxiliary enclosures 818 and 818′,respectively, at an earlier stage of deployment of the data pod farm1400 is described below with respect to FIGS. 17, 17A, and 17B

FIGS. 2A-2G depict modular data pods having different polygonal shapesaccording to embodiments of the present disclosure. The polygonal shapesof the modular data pods offer several benefits. The exterior of thepolygonal shapes is conducive to space-efficient packing or grouping.And the interior of the polygonal shapes allows for tight arrangement ofsquare or rectangular server racks corner to corner in a circularpattern within the polygonal shape of the modular data pod.

This arrangement defines an efficient partition between the hot and coldaisles. For example, in those embodiments where the computer racks arearranged so that they radiate or blow heat towards the walls of the datapod, the hot aisle is defined by the air space between the walls of themodular data pod and the computer racks and the cold aisle is defined bythe air space created by the sides of the computer racks that facetowards the center of the modular data pod. In other embodiments, thecomputer racks may be arranged so that the cold aisle is defined by theair space between the walls of the modular data pod and the computerracks and the hot aisle is defined by the air space created in themiddle of the modular data pod by the sides of the computer racks thatface towards the center of the modular data pod.

The tight grouping of the computer racks also allows for efficient useof the close distance between related equipment that is mounted in thecomputer racks. The result is efficient partitioning of hot and coldaisles, close grouping (i.e., space savings), and close distancesbetween computer systems for electrical, mechanical, and ITinterconnections and treatments.

As shown in FIGS. 2A-2G, the walls of the modular data pod may bearranged in a variety of different polygonal shapes including a pentagon(e.g., the modular data pod 50 of FIG. 2A), hexagon (e.g., the modulardata pod 60 of FIG. 2B), heptagon (e.g., the modular data pod 70 of FIG.2C), octagon (e.g., the modular data pod 80 of FIG. 2D), nonagon (e.g.,the modular data pod 90 of FIG. 2E), and decagon (e.g., the modular datapod 100 of FIG. 2F). These shapes can also be modified. For example, theoctagonal-shaped modular data pod 80 of FIG. 2D can be stretched in onedirection to increase the length of two walls of the modular data pod toform the modular data pod 80 of FIG. 2G.

In one embodiment of the present disclosure illustrated in FIG. 2A,modular pentagonal data pod 50 includes a data enclosure 105 includingfive external wall members 1051, 1052, 1053, 1054, and 1055 that arecontiguously joined to one another along at least one edge. For example,edges 55 contiguously join external wall member 1051 to wall member1052, external wall member 1052 to external wall member 1053, externalwall member 1053 to external wall member 1054, external wall member 1054to external wall member 1055, and external wall member 1055 to externalwall member 1051, in the shape of a polygon.

The pentagonal modular data pod 50 includes server rack 501 positionedinternally in the modular data pod 50 in proximity to external wallmember 1051, server rack 502 positioned internally in the modular datapod 50 in proximity to external wall member 1052, server rack 503positioned internally in the modular data pod 50 in proximity toexternal wall member 1053, server rack 504 positioned internally in themodular data pod 50 in proximity to external wall member 1054, andserver rack 505 positioned internally in the modular data pod 50 inproximity to external wall member 1055.

To define a heat exchange volume 5002 substantially within a centralregion of the modular data pod 50, server racks 501 and 505, which areillustrated as being spaced apart from one another, may be contiguouslyjoined together via internal wall member 550. Similarly, server racks501 and 502, which are illustrated as being spaced apart from oneanother, may be contiguously joined together via internal wall member510. (As defined herein, an internal wall member is a wall memberdisposed within the confines of each individual modular data pod definedby the external wall members).

Although server racks 502 and 503 and server racks 504 and 505 are alsoillustrated as being spaced apart from one another, those skilled in theart will recognize that internal wall members similar to internal wallmembers 510 and 550 may be disposed to contiguously join server racks502 and 503 or server racks 504 and 505. Additionally, those skilled inthe art will also recognize that the first heat exchange volume 5001need not be tightly confined at each and every position between adjacentserver racks to create suitable heat transfer conditions within themodular data pod 50.

The modular data pod 50 also includes an auxiliary enclosure 515adjacent to external wall member 1051. In other embodiments, theauxiliary enclosure 515 may be adjacent to one of the external wallmembers 1051 to 1055. The auxiliary enclosure 515 includes aclose-coupled dedicated cooling system 525 for chiller-less operation inhigh wet-bulb temperature applications, which is further described indetail below with respect to FIGS. 3, 4, and 5.

In one embodiment of the present disclosure as illustrated in FIG. 2B, amodular hexagonal data pod 60 includes an enclosure 106 having sixexternal wall members 1061, 1062, 1063, 1064, 1065, and 1066 that arecontiguously joined to one another along at least one edge in the shapeof a polygon.

The hexagonal modular data pod 60 includes server rack 601 positionedinternally in the modular data pod 60 in proximity to both external wallmember 1061 and external wall member 1062, server rack 602 positionedinternally in the modular data pod 60 in proximity to external wallmember 1063, server rack 603 positioned internally in the modular datapod 60 in proximity to both external wall member 1063 and external wallmember 1064, server rack 604 positioned internally in the modular datapod 60 in proximity to both external wall member 1064 and external wallmember 1065, server rack 605 positioned internally in the modular datapod 60 in proximity to external wall member 1065, and server rack 606positioned internally in the modular data pod 60 in proximity to bothexternal wall member 1066 and external wall member 1061.

In a similar manner as described above with respect to modular data pod50, to define a heat exchange volume 6002 substantially within a centralregion of the modular data pod 60, in one embodiment, the server racks601 and 602, which are illustrated as being spaced apart from oneanother, may be contiguously joined together via an internal wall member610 between the server racks 601 and 602. Again, although the serverracks 605 and 606 are illustrated as being spaced apart from oneanother, those skilled in the art will recognize that internal wallmembers similar to internal wall member 610 may be disposed tocontiguously join the corresponding server racks 605 and 606. Again,those skilled in the art will also recognize that the first heatexchange volume 6001 need not be tightly confined at each and everyposition between adjacent server racks in order for proper intended heattransfer conditions to occur within the modular data pod 60.

The modular data pod 60 also includes an auxiliary enclosure orcompartment 616 adjacent to one of the external wall members 1061 to1066, with the auxiliary enclosure 616 illustrated as being adjacent toexternal wall member 1061. Again, the auxiliary enclosure 616 includes aclose-coupled dedicated cooling system 626 for operation in highwet-bulb temperature applications, which is described in detail belowwith respect to FIGS. 3, 4 and 5. In some embodiments, the close-coupleddedicated cooling system 626 may allow for chillerless operation in highwet-bulb temperature applications.

In another embodiment of the present disclosure as illustrated in FIG.2C, a modular heptagonal data pod 70 includes an enclosure 107 includingseven external wall members 1071, 1072, 1073, 1074, 1075, 1076, and 1077that are contiguously joined to one another along at least one edge inthe shape of a polygon.

The heptagonal modular data pod 70 includes server rack 701 positionedinternally in the modular data pod 70 in proximity to both external wallmember 1071 and external wall member 1072, server rack 702 positionedinternally in the modular data pod 70 in proximity to external wallmember 1072 and also in proximity to external wall member 1073, serverrack 703 positioned internally in the modular data pod 70 in proximityto external wall member 1073, server rack 704 positioned internally inthe modular data pod 70 in proximity to external wall member 1074,server rack 705 positioned internally in the modular data pod 70 inproximity to external wall member 1075, server rack 706 positionedinternally in the modular data pod 70 in proximity to external wallmember 1076, server rack 707 positioned internally in the modular datapod 70 in proximity to both external wall member 1076 and external wallmember 1077, and server rack 708 positioned internally in the modulardata pod 70 in proximity to both external wall member 1077 and externalwall member 1071.

In a similar manner as described above with respect to modular data pods50 and 60, the server racks 701 to 708 are contiguously or substantiallycontiguously disposed to define heat exchange volume 7002 substantiallywithin a central region of the modular data pod 70.

Similarly, the modular data pod 70 also includes an auxiliary enclosure717 adjacent to one of the external wall members 1071 to 1077, with theauxiliary enclosure 717 illustrated as being adjacent to external wallmember 1071. Similarly, the auxiliary enclosure 717 includes aclose-coupled dedicated cooling system 727 for operation in highwet-bulb temperature applications which is further described in detailbelow with respect to FIGS. 3, 4 and 5.

In one embodiment of the present disclosure as illustrated in FIG. 2D,modular octagonal data pod 80 includes an enclosure 108 including eightexternal wall members 1081, 1082, 1083, 1084, 1085, 1086, 1087 and 1088that are contiguously joined to one another along at least one edge inthe shape of a polygon. The octagonal modular data pod 80 includesserver racks 801, 802, 803, 804, 805, 806, 807 and 808, each of which ispositioned internally in the modular data pod 80 in proximity to, and ina position in angular relationship with two of the external wall members1081-1088.

Again, in a similar manner as described above with respect to modulardata pods 50, 60 and 70, the server racks 801 to 808 are contiguously orsubstantially contiguously disposed to define heat exchange volume 8002substantially within a central region of the modular data pod 80.

Similarly, the modular data pod 80 also includes an auxiliary enclosure818 adjacent to one of the external wall members 1081 to 1088, with theauxiliary enclosure 818 illustrated as being adjacent to external wallmember 1081. As described previously, the auxiliary enclosure 818includes a close-coupled dedicated cooling system 828 for operation inhigh wet-bulb temperature applications which is further described indetail below with respect to FIGS. 3, 4 and 5.

In one embodiment of the present disclosure as illustrated in FIG. 2E,modular nonagonal data pod 90 includes an enclosure 109 including nineexternal wall members 1091, 1092, 1093, 1094, 1095, 1096, 1097, 1098,and 1099 that are contiguously joined to one another along at least oneedge, e.g., edges 99, to form the shape of a polygon. The nonagonalmodular data pod 90 includes eight server racks 901, 902, 903, 904, 905,906, 907, and 908 positioned internally in the modular data pod 90 inproximity to, and in a position in angular relationship with, at leastone of the external wall members 1091 to 1099.

In a similar mariner as described above with respect to modular datapods 50, 60, 70, and 80, the server racks 901 to 808 are contiguously orsubstantially contiguously disposed to define heat exchange volume 9002substantially within a central region of the modular data pod 90.

The modular data pod 90 also includes an auxiliary enclosure 919adjacent to one of the external wall members 1091 to 1099, with theauxiliary enclosure 919 illustrated as being adjacent to external wallmember 1091. As described above, the auxiliary enclosure 919 includes aclose-coupled dedicated cooling system 928 for operation in highwet-bulb temperature applications, which is further described in detailbelow with respect to FIGS. 2, 3, and 4.

In another embodiment of the present disclosure as illustrated in FIG.2F, a modular decagonal data pod 100 includes an enclosure 110 havingten external wall members 1101, 1102, 1103, 1104, 1105, 1106, 1107,1108, 1109, and 1110 that are contiguously joined to one another alongat least one edge, e.g., edges 111, in the shape of a polygon. Thedecagonal modular data pod 100 includes eight server racks 1001, 1002,1003, 1004, 1005, 1006, 1007, and 1008 positioned internally in thedecagonal modular data pod 100 in proximity to, and in a position inangular relationship with, at least one of the ten external wall members1101 to 1110.

Again, in a similar manner as described above with respect to modulardata pods 50, 60, 70, 80, and 90, the server racks 1001 to 1008 arecontiguously or substantially contiguously disposed to define a heatexchange volume 102 substantially within a central region of the modulardata pod 100.

Again, the modular data pod 100 also includes an auxiliary enclosure1010 adjacent to one of the external wall members 1101 to 1110, with theauxiliary enclosure 1010 illustrated as being adjacent to external wallmember 1101. Again, the auxiliary enclosure 1010 includes aclose-coupled dedicated cooling system 1020 for operation in highwet-bulb temperature applications which is further described in detailbelow with respect to FIGS. 3, 4, and 5.

In another embodiment of the present disclosure as illustrated in FIG.2G, the octagonal-shaped modular data pod 80 of FIG. 2D can be stretchedin one direction to increase the length of two walls of the modular datapod 80 to form an elongated octagonal modular data pod 80′. Moreparticularly, the octagonal modular data pod 80′ includes an enclosure108′ having external wall members 1081′, 1082′, 1083′, 1084′, 1085′,1086′, 1087′, and 1088′ that are contiguously joined to one anotheralong at least one edge, e.g., edges 88′, in the shape of a polygon.

The octagonal modular data pod 80′ includes server racks 801′ and 802′that are positioned internally in the modular data pod 80′ in proximityto external wall member 1081′ and external wall member 1082′,respectively. Adjacent server racks 803 a′, 803 b′, 803 c′, and 803 d′are also positioned internally in the octagonal modular data pod 80′,each in proximity to elongated external wall member 1083′. Server racks804′, 805′, and 806′ are positioned internally within the modular datapod 80′ in proximity to external wall members 1084′, 1085′, and 1085′,respectively. Adjacent server racks 807 a′, 807 b′, 807 c′, and 807 d′are also positioned internally in the octagonal modular data pod 80′,each in proximity to elongated external wall member 1087′. Server rack808′ is also positioned internally in the octagonal modular data pod 80′in proximity to external wall member 1088′.

Contiguous external wall members 1088′, 1081′, and 1082′ form a firstend 88 a′ of the modular data pod 80′ while correspondingly contiguousexternal wall members 1084′, 1085′, and 1086′ form a second end 88 b′ ofthe modular data pod 80. Similarly, as described above with respect tomodular data pods 50, 60, 70, 80, 90, and 100, the server racks 801′ to808′ are contiguously or substantially contiguously disposed to defineheat exchange volume 8002′ substantially within a central region of themodular data pod 80.

Again, the modular data pod 80′ also includes an auxiliary enclosure818′ adjacent to one of the external wall members 1081′ to 1088′, withthe auxiliary enclosure 818′ illustrated as being adjacent to externalwall member 1081′. Similarly, the auxiliary enclosure 818′ includes aclose-coupled dedicated cooling system 828′ for operation in highwet-bulb temperature applications which is further described in detailbelow with respect to FIGS. 3, 4, and 5.

FIG. 3 is a sectional side view (i.e., elevation view) of a genericmodular data pod generically designated as modular data pod 10. FIG. 3illustrates an airflow pattern within the airflow circuit of the coolingsystem for a modular data pod. The modular data pods may use a varietyof airflow patterns and hot and cold aisle configurations. For example,as shown in FIG. 3, the hot aisle can be at the rear or sides of theserver rack and the cold aisle can be at the center of the modular datapod. This airflow pattern provides a natural chimney or upwardconvection of hot air within the hot aisle while the cold aisle is anatural downward airflow pattern of cold air that can be assisted by thefans.

As another example, the hot aisle could be in the center and the coldaisle would be at the rear of the server racks. The top of the rackscould also be modified to allow hot air to flow within the rack or shelfitself and exit at either the top or the bottom of the racks. Withrespect to airflow patterns, the hot air may flow in an upward,downward, or other direction.

The modular data pods may also be designed to maintain neutralizationtemperatures at various locations in the airflow circuit. In theembodiment of FIG. 3, the primary cooling occurs at the rear of theserver racks or shelving.

The fans may be arranged in other ways to create other airflow patternsknown to those skilled in the art. The fans may also be positionedanywhere within the modular data pod. For example, the fans may bepositioned in the upper or lower portion of the modular data and theymay be oriented horizontally or vertically. The position and type of fanmay depend on the latest advances in fan technology, includingimprovements in fan efficiency.

The cooling coil configuration shown in FIG. 3 provides redundancy byproviding three ways (N+3) of cooling the air within the modular datapod. The one or more batteries may be mounted within the floor chamberas shown in FIG. 3 or somewhere within the cold aisle.

More particularly, modular data pod 10 generically represents, forexample, modular data pods 50, 60, 70, 80, 90, 100, and 80′ describedabove with respect to FIGS. 2A to 2G, respectively. Modular data pod 10includes a data pod covering member 12 that substantially forms a roofof the modular data pod 10. The data pod covering member 12 may be incontact with, and supported by, for example, upper edges 1051 a and 1053a of the external wall members 1051 and 1053, respectively, of data pod50 (see FIG. 2A). The external wall members 1051 to 1055 define anaperture 12′ at an upper end 11 of the enclosure 105 and also defineinner surfaces 1051 a, 1052 a, 1053 a, 1054 a, and 1055 a of theexternal wall members 1051 to 1055, respectively (see FIG. 2A). Thus,the data pod covering member 12 is configured and disposed tosubstantially cover the aperture 12′.

The computer racks 501 to 505 each define first sides 501 a, 502 a, 503a, 504 a, 505 a in relationship with the inner surfaces 1051 a to 1055 aof the external wall members 1051 to 1055, respectively, to define afirst volume or hot aisle 5001 between the inner surfaces 1051 a, 1052a, 1053 a, 1054 a, and 1055 a and the first sides 501 a, 502 a, 503 a,504 a, 505 a defined by the computer racks 501 to 505, respectively.First cooling coils 531 and 533 are illustrated disposed on the firstsides 501 a and 503 a of server racks 501 and 503, respectively.

The computer racks 501 to 505 each define second sides 501 b, 502 b, 503b, 504 b, 505 b, respectively, that are substantially oriented tointerface with at least another second side to define a second volumetherebetween, e.g., the heat exchange volume or cold aisle 5002described above with respect to FIG. 2A. Those skilled in the art willrecognize that heat exchange volumes 6002, 7002, 8002, 9002, 102, and8002′ illustrated in FIGS. 2B, 2C, 2D, 2E, 2F, and 2G, respectively,similarly form second volumes defined by the respective second sides ofthe computer racks.

The modular data pod 10 also includes a computer rack covering member 14that is configured and disposed generally above the server racks 501 to505 to substantially enclose the second volume or heat exchange volume5002. The data pod covering member 12 and the computer rack coveringmember 14 form a third volume 20 that couples the first volume 5001 tothe second volume 5002.

An air circulator support structure 16 is also configured and disposedgenerally above the server racks 501 to 505 and forms part of thecomputer rack covering member 14. The air circulator support structure16 is generally disposed above the second volume 5002 to define acentral upper boundary of the second volume 5002. The air circulatorsupport, structure 16 includes at least one air circulator, of whichthree air circulators 16 a, 16 b, and 16 c are illustrated forcirculating air downwardly, as shown by arrows A. The second volume 5002forms a cold aisle. The downwardly circulating air circulates throughthe servers 511 a, 511 b, . . . , 511 n disposed on server rack 501 andthrough the servers 533 a, 533 b, . . . , 533 n to remove heattherefrom, and through the first cooling coils 531 and 533, where theair heated by the servers is then cooled, (Similar cooling coils, notshown, are disposed on first sides 502 a, 504 a, and 505 a of serverracks 502, 504, and 505, respectively).

The cooled air moves upwardly through the first volume 5001 as shown bythe arrows B and further moves upwardly to the third volume 20. In oneembodiment, second cooling coils 21 and 23 are disposed in the path ofthe circulating air between the computer rack covering member 14 and thedata pod covering member 12, and in a position generally directlyoverhead corresponding first cooling coils 531 and 533 of server racks501 and 503, respectively, to define the boundaries of the third volume20. The second cooling coils 21 and 23 further cool the air, which thenmoves into the third volume 20 as shown by the arrows C where the air isdrawn through the suction sides of the air circulators 16 a, 16 b, and16 c.

In one embodiment, the air circulator support structure 16 furtherincludes a third cooling coil 30 that is disposed on the suction sidesof the air circulators 16 a, 16 b, 16 c for further cooling of the aircirculating through the air circulators 16 a, 16 b, 16 c.

Thus, the one or more air circulators 16 a, 16 b and 16 c are configuredto continuously circulate air through the first volume 5001, the secondvolume 5002, and third volume 5003.

In one embodiment, the cooling coils 531, 533, 21, 22, and 30 include arefrigerant, non-aqueous solution, gas, or liquid as the cooling medium.As defined herein, the cooling coils 531, 533, 21, 22, and 30 are heatexchange members.

In one embodiment, the modular data pod 10 includes a dedicatedelectrical power supply, illustrated as one or more batteries 32 at alower end 11′ of the data pod enclosure 105. The one or more batteriesmay be in electrical communication with a direct current to alternatingcurrent (DC/AC) inverter (not shown), which, in turn, is in electricalcommunication with an offsite electrical power grid (not shown).

Consequently, in the exemplary embodiment of FIG. 3, a hot aisle isformed between a back side of the IT cabinets or computer server racksand the walls of the modular data pod and a cold aisle is formed by afront side of the computer racks. In other words, the computer racks orshelving are positioned to create a hot aisle and a cold aisle. In otherembodiments, the computer racks are positioned in other ways to createother hot and cold aisle configurations. In yet other embodiments, thehot and cold aisles are strictly contained.

The fans, coils, computer racks, one or more batteries, hot aisle, coldaisle, and piping tunnels are all positioned within the modular data podenvelop or container. Additional compartments are attached to a side ofthe modular data pod. These compartments include an exchanger module,pipes for the cooling system, a pump for pumping cooling fluid (e.g.,refrigerant or deionized water) through the pipes, cable buses, andelectrical compartments. These compartments may be waterproof. A usermay access these compartments, e.g., to perform deployment ormaintenance tasks, via an access door.

The fans may be arranged in other ways to create other airflow patternsknown to those skilled in the art. The fans may be positioned anywherewithin the modular data pod. For example, the fans may be positioned inthe upper or lower portion of the modular data pod and they may beoriented horizontally or vertically. The position and type of fan maydepend on the latest advances in fan technology, including improvementsin fan efficiency.

The modular data pods are designed to include significant ramp up (ormodularity) capabilities in power, data collection, and HVAC coolingcapacity. Each pod may be designed to handle a spectrum of server rackloads from the low end, i.e., about 1-2 kW per server rack, to the highend, i.e., about 40 kW per server rack.

The modular data pods may use both natural convection and air movementdevices (e.g., fans or other devices that can move air or create airpatterns) to move air through the hot aisle/cold aisle circuit. The airmovement devices may be coupled to energy efficient VFDs that cancontrol the air movement devices using state of the art controlstrategies that monitor both cold aisle temperature and server and rackloading according to cloud computing technology.

The cooling coils in the modular data pods may employ micro-channel coiltechnology. These cooling coils require far less depth and surface areathan typical cooling coils. The modular data pods may be built withremovable coil sections that are adapted to accept replacement coils,such as coils that provide higher output or that incorporate futureadvances in coil technology. The modular data pod main coil circuit mayinclude a hybrid dual coil systems consisting of a standard refrigerantevaporation coil, a receiver, and a tandem micro-channel coil. Thispairing of coil technology enables greater heat transfer capabilities byusing the benefits of refrigerant “change of state.” Alternatively, thesystem can include a straight liquid-pumped system without change ofstate.

The modular data pods may be built to various seal classifications. Forexample, the membrane sealants, wall construction, gasketing, and doortreatments may be adjusted to meet various seal requirements includingthe seal requirements promulgated by Sheet Metal and CoolingContractors' National Association (SMACNA). The modular data pods mayalso include non-conductive fire suppression systems.

The modular data pods may be designed to receive either manufacturedserver racks or custom designed rack and shelving components. Customracks or shelving components can be included as part of the overallphysical structure of the modular data pod to provide a strong“skeletal” system that can be easily removed, adapted, and modified, toconform to the various types of server supports.

The modular data pod structure may be a durable but light structure. Forexample, it may be made of a composite of light steel square tubing orI-beams and heavy gauge aluminum structural members. The walls and roofof the modular data pods can include either double or single-wallinsulated panels. They can be constructed of metal, plastic, glass, orother composite materials. The modular data pods can have structuralskeletal framing, or receive, skin treatments that have structuralcapabilities. The type and extent of insulation used in the modular datapod may vary based on the environment in which the pod is deployed orany other requirements of an operator.

The exterior of the modular data pods may be treated with energy-savingreflective paints, surface coatings, or solar membranes (e.g.,photovoltaic) or coatings. The roof structure may include supports andhold downs for solar panels in farm-type applications.

The modular data pod structure can be fitted with lifting lug andsupport structures than will enable it to be lifted from above or belowusing forklifts, gantry, cranes, helicopters, or other riggingequipment. The server racks or shelving may include restraints to securethe server racks and other equipment in the modular data pod fortransport.

The modular data pods can be fitted with packaged humidity controls andsystems. For example, the modular data pods can be fitted with membrane,vapor barriers, sealants, and other humidity control features to limitmigration of humidity from external spaces or the environment into themodular data pod envelop.

The modular data pods may or may not include access doors. The doors mayinclude double marine insulated vision glass for external inspection ofthe modular data pod. The modular data pods may be fitted with lightingand service receptacles, both internally and externally as needed. Allelectrical circuits may be protected with ground fault protection.Modular data pods intended for outdoor use may include structure forlightning protection.

The modular data pods may be pre-stacked with computer racks at acentrally controlled location before they are deployed on site. Thissaves the time and expense required to stack a modular data pod withcomputer racks on site, especially in remote areas.

FIG. 4 is a plan view (i.e., sectional top view) of the octagonalmodular data pod 80 of FIG. 2D showing an octagonal upper coil deck 838a that vertically supports an array 840 of vertically disposed uppercooling coils 841, 842, 843, 844, 845, 846, 847, and 848 disposed aboverespective server racks 801, 802, 803, 804, 805, 805, 806, 807, and 808.Each of the vertically disposed upper cooling coils 841, 842, 843, 844,845, 846, 847, and 848 forms a boundary in an analogous manner to secondcooling coils 21 and 22 that are disposed in the path of the circulatingair between the computer rack covering member 14 and the data podcovering member 12 to define the boundaries of the third volume 20 asdescribed with respect to modular data pod 10 in FIG. 3.

Lower rear coils on the back side (not shown) of each of the computerracks 801 to 808 are analogous to refrigerant coils 531 and 533 in FIG.3. The lower rear coils are the first stage or the primary way ofcooling the air flowing in hot aisles 851, 852, 853, 854, 855, 856, 857,and 858. Hot aisle 851 is formed between the rear side of server rack801 and external wall members 1081 and 1082. Hot aisle 852 is formedbetween the rear side of server rack 802 and external wall members 1082and 1083. Similarly, hot aisle 853 is formed between the rear side ofserver rack 803 and external wall members 1083 and 1084. Hot aisle 854is formed between the rear side of server rack 804 and external wallmembers 1084 and 1085. Those skilled in the art will recognize how hotaisles 855 to 858 are similarly formed.

The upper vertical coil array 840, which is in an octagonal shape, isthe secondary way of cooling (n+2) the air flowing in the hot aisles 851to 858. Piping connections 840 a and 840 b provide fluidic communicationwith a refrigerant gas fluid supply path 4100 a, which is in fluidcommunication with the environment 5 of the electronic equipment, andfluid return path 4100 b, which is also in fluid communication with theenvironment 5 of the electronic equipment, described below with respectto FIG. 6.

An overhead flat-plate coil 860, analogous to third cooling coil 30 thatis disposed on the suction sides of the air circulators 16 a, 16 b, 16 cmay be positioned at the center (as shown) of the modular data pod 80 asthe third way of cooling (n+3) the air flowing from the hot aisles 851to 858. This third coil 860 can also be used as a “trim” coil if theheat load at any server rack coil requires supplemental cooling. Thethird coil 860 handles the occasional overloading at specific serverracks. The third coil 860 can also be used as an energy-saving coil forextremely low-load heat output conditions. The control strategies forcooling server racks within the modular data pod 80 may include shuttingdown the primary or main coils (not shown) and activating the third coil860 to handle low system loads. Piping connections 860 a and 860 bprovide fluidic communication with the refrigerant gas fluid supply path4100 a, which is in fluid communication with the environment 5 of theelectronic equipment, and fluid return path 4100 b, which is also influid communication with the environment 5 of the electronic equipment,described below with respect to FIG. 6.

FIG. 5 is a plan view (i.e., sectional top view) at the ceiling level ofmodular data pod 80 showing a ceiling fan assembly 870. The computerracks 801 to 804 and 806 to 806 each include corners 801 a, 801 b forserver rack 801, corners 802 a, 802 b for server rack 802, corners 803a, 803 b for server rack 803, corners 804 a, 804 b for server rack 804,corners 806 a, 806 b for server rack 806, corners 807 a, 807 b forserver rack 807, and corners 808 a, 808 b for server rack 808. Theserver racks 801 to 804 and 806 to 808 are shown disposed in a circularpattern with corners 801 a and 801 b of rack 801 in contact with thecorners 808 b and 802 a of adjacent computer racks 808 and 802,respectively.

Those skilled in the art will understand the arrangement of the cornersof the remaining server racks 802, 803, 804, 806, and 807. Thisarrangement of the server racks 801 to 804 and 806 to 808 in a circularpattern provides a partition between the hot aisles 851 to 854 and 856to 858 and the cold aisle formed by volume 8002. In some embodiments,the pie-shaped air spaces 851′, 852′, 853′, 856′, 857′, and 858′ betweenthe computer racks 801 and 802, 802 and 803, 803 and 804, 806 and 807,807 and 808, and 808 and 801, respectively, may be partitioned off fromthe cold aisle 8002 and form part of the hot aisles 851, 852, 853, 854,856, 857, and 858. As shown in FIG. 5, the modular data pod may fitseven server racks (e.g., 40 kW server racks). There is a space 805′between two server racks, e.g., server racks 804 and 806, to give ahuman operator access to the server racks 801-804 and 806-808 via accessdoor 81. In some embodiments, the modular data pod does not include anaccess door. In these embodiments, the modular data pod may it eightserver racks.

Fans 871 of fan assembly 870 and lighting 880 are positioned at theceiling level of the modular data pod 80. The fans are driven byvariable-frequency drives (VFDs) (not shown), which may be controlled bythe central cooling system 1420 of a Building Management System (BMS).The central cooling system 1420 can increase or decrease the fan speedbased on temperature and/or the loading of the computer racks. Forexample, the central cooling system 1420 can increase the fan speed asthe temperature within the hot aisles increases.

FIG. 5 also shows the cooling pipes 882 that enter and exit a lower pipechase (not shown). The lower pipe chase may be removable and may belocated below auxiliary enclosure 818 that includes the heat exchangers(the complete close-coupled cooling system 4000, which includescondensers 1200 a, 1200 b, and 1300, is described below with respect toFIG. 6) and electrical equipment of the modular data pod assembly. Thecooling pipes 882 include six pipes: two supply pipes for supplyingcooling fluid to the coils of the modular data pod, two return pipes forreturning cooling fluid to the cooling system, and two reverse returnpipes. The modular data pod assembly may include waterproof partitionsbetween the various compartments.

The exemplary modular data pods 10, 50, 60, 70, 80, 90, 100, and 80′ aredesigned to be universal in their use for computer data storage. Theycan be used for singular pod deployment. They can be trailerized fortemporary or semi-permanent use. They can be used indoors in warehouseor suite-type applications. They can be deployed in outdoor or“farm”-type environments. The benefit of their space-saving shape, size,and relative weight allows them to be implemented where it is notpractical logistically or otherwise to use other large and heavy“containerized” modular products.

FIG. 6 depicts a close-coupled cooling system 4000 designed to coolelectronic equipment of an IT data center. The system 4000 includes fourindependent, yet cooperating, fluid circuits designated as 4100, 4200,4300, and 4400, respectively.

The first circuit 4100 interfaces with the electronic equipment of theIT data center, and provides cooling to the electronic equipment via afirst fluid. The first fluid may contain a liquid refrigerant R134a orsimilar refrigerants. The first circuit 4100 includes at least oneevaporator coil (not shown in FIG. 6, but see, e.g., the evaporatorcoils of FIG. 12) that is in thermal communication with the electronicequipment and extracts heat from the electronic equipment to the firstfluid. As the first fluid flows from an inlet of the at least oneevaporator coil to an outlet of the evaporator coil, heat is transferredfrom the electronic equipment to the first fluid. In one embodiment, thefirst fluid enters the at least one evaporator coil at a temperature ofapproximately 23° C. During heat transfer or exchange, the first fluidtransforms from a liquid state to an at least partially vapor state.

The first circuit 4100 includes a fluid supply path 4100 a and a fluidreturn path 4100 b coupled to the inlet and outlet of the at least oneevaporator coil, respectively. The fluid supply path 4100 a delivers thefirst fluid in a liquid state to the inlet of the at least oneevaporator coil, and the fluid return path 4100 b receives the firstfluid in an at least partially vapor state from the outlet of the atleast one evaporator coil. The first circuit 4100 includes a liquidrefrigerant pump 4120 that pumps the first fluid through the fluidsupply path 4100 a. The first circuit 4100 also includes a variablefrequency drive 4125 that regulates capacity and motor speed of theliquid refrigerant pump 4120.

The first circuit 4100 further includes a main condenser 1300 thatreceives the first fluid from the fluid return path 4100 b. The maincondenser 1300 is a refrigerant-to-water heat exchanger that cools thefirst fluid that passes through the main condenser 1300 and condensesthe first fluid from the at least partially vapor state to the liquidstate. In one embodiment, to fully condense and cool the first fluid,the main condenser 1300 is maintained at a predetermined condensingtemperature of approximately 23.3° C. or lower.

Further, the first circuit 4100 may include (1) a fluid path 4100 c thatcarries the first fluid from the main condenser 1300 to a refrigerantliquid receiver 4128, and (2) a fluid path 4100 d that carries the firstfluid from the refrigerant liquid receiver 4128 to a suction side of theliquid refrigerant pump 4120.

The refrigerant liquid receiver 4128 is configured to detect andregulate the temperature of the first fluid. Specifically, therefrigerant liquid receiver 4128 is configured to reduce the temperatureof the first fluid by thermally coupling the first circuit 4100 to thefourth circuit 4400. In some embodiments, the refrigerant liquidreceiver 4128 maintains the first fluid at a predetermined temperaturebetween approximately 22.2° C. and approximately 23.3° C.

The refrigerant liquid receiver 4128 may also include components (e.g.,detector and a controller) configured to detect and regulate the liquidlevel of the first fluid contained in the refrigerant liquid receiver4128. A low liquid level in the refrigerant liquid receiver 4128 maycause cavitation problems at the liquid refrigerant pump 4120. To avoidthis problem, the refrigerant liquid receiver 4128 includes a liquidlevel controller 4127 that detects the liquid level in the receiver 4128and triggers an alarm if a low liquid level is detected. Also, therefrigerant liquid receiver 4128 may collect the first fluid in thefirst circuit 4100 when the cooling system 4000 is in an idle or standbymode.

The first circuit 4100 also includes a temperature sensor 4126 that islocated on the fluid path 4100 e at the exit of the main condenser 1300.The temperature sensor 4126 detects the temperature of the first fluidwhen it exits from the main condenser 1300. The readings of thetemperature sensor 4126 reflect the temperature of the main condenser1300.

The second circuit 4200 interfaces with the first circuit 4100 at themain condenser 1300 a, where the second circuit 4200 performs heatexchange with the first circuit 4100. Specifically, the second circuit4200 has a second fluid flowing through it. The second fluid removesheat from the first fluid of the first circuit 4100 at the maincondenser 1300 a. In one embodiment, upon exiting the main condenser1300 a, the second fluid has a temperature of approximately 22.8° C.

The second circuit 4200 includes a fluid path 4200 a that carries thesecond fluid from a cooling tower, fluid cooler, or dry cooler (notshown in FIG. 6, but see, e.g., cooling tower CT-1A of FIG. 14) to thesecond circuit 4200. The fluid path 4200 a is fluidly coupled to a fluidpath 4200 d which delivers the second fluid to the main condenser 1300.The second circuit further includes a fluid path 4200 h that receivesthe second fluid from the main condenser 1300. The fluid path 4200 h isfluidly coupled to a fluid path 4200 e which carries the second fluid toa fluid path 4200 m that delivers the second fluid back to the coolingtower, fluid cooler, or dry cooler.

In some embodiments, the second circuit 4200 includes a pump tofacilitate the flow of the second fluid through the second circuit 4200.In one embodiment, the second fluid is regulated at a flow rate ofapproximately 1192 liters/minute. The pump may be in any of thefollowing forms: a central pumping and cooling tower, dry cooler, fluidcooler, well water circuit, or other chilled water circuit.

Further, the second circuit 4200 may include a mixed water temperaturesensor 4220 that monitors the temperature of the second fluid before itenters the main condenser 1300. The second circuit 4200 may also includea water regulating valve 4214, which operatively communicates with thetemperature sensor 4126 of the first circuit 4100. The water regulatingvalve 4214 is configured to regulate the flow rate of the second fluidin proportion to the readings of the temperature sensor 4126.

For instance, to maintain the main condenser 1300 at or below apredetermined condensing temperature (e.g., 23.3° C.), the waterregulating valve 4214 adjusts the flow rate of the second fluid based onthe temperature of the main condenser 1300 as measured by thetemperature sensor 4126. For example, if the temperature sensor 4126 hasa reading significantly higher than the predetermined condensingtemperature (e.g., 23.3° C.) of the main condenser 1300, the waterregulating valve 4214 then significantly increases the flow rate of thesecond fluid flowing through the second circuit 4200 to thereby rapidlyreduce the temperature of the main condenser 1300. However, if thetemperature sensor 4126 has a reading slightly higher than thepredetermined condensing temperature (e.g., 23.3° C.), the waterregulating valve 4214 then slightly increases the flow rate of thesecond fluid flowing through the second circuit 4200.

In some embodiments, to maintain the temperature of the main condenser1300 at or below the predetermined condensing temperature (e.g., 23.3°C.), the second fluid is maintained at a threshold temperature ofapproximately 18.9° C. or lower.

To maintain the second fluid at or below the threshold temperature(e.g., 18.9° C.), the second circuit 4200 may include at least onecooling mode to cool the second fluid. For example, the second circuit4200 may include a simple free-cooling mode in which the second circuit4200 relies on the atmosphere to cool the second fluid via a coolingtower, fluid cooler, or dry cooler. In operation, after heat istransferred from the first fluid to the second fluid at the maincondenser 1300, the second fluid follows the fluid paths 4200 h, 4200 eand proceeds to a cooling tower, fluid cooler, or dry cooler (not shownin FIG. 6) to reject its heat into the atmosphere. The cooled secondfluid then follows the fluid paths 4200 a and 4200 d back to the maincondenser 1300 to cool the first fluid. It is envisioned that the secondfluid may continuously repeat the above cycle.

In one embodiment, the simple free-cooling mode maintains the secondfluid at or below the threshold temperature (e.g. 18.9° C.) only whenthe wet-bulb temperature of the IT data center is below 17.2° C. If thewet-bulb temperature is above 17.2° C., the second fluid may exceed itsthreshold temperature.

Further, the second circuit 4200 may include a mechanical compressedcooling mode, in which the third circuit 4300 cools the second circuit4200 through mechanical compression cycles. A third fluid flows throughthe third circuit 4300. The third fluid may contain a liquidrefrigerant, such as R134a, or any other suitable refrigerant.

The third circuit 4300 includes an atmospheric sub-cooler exchanger 1200a to sub-cool the second fluid 4200 before the second fluid arrives atthe main condenser 1300. The atmospheric sub-cooler exchanger 1200 a isa refrigerant-to-water heat exchanger that trims or cools at least aportion of the second fluid. The third circuit 4300 may also include atrim condenser 1200 b, which is a refrigerant-to-water heat exchangerthat transfers heat in the third fluid, which is the heat that the thirdfluid has absorbed from the second fluid at the atmospheric sub-coolerexchanger 1200 a, back to the second fluid. The third circuit 4300 mayfurther include a sub-cooler compressor 4310 that compresses the thirdfluid.

The third circuit 4300 includes a fluid path 4300 a that carries thethird fluid from the atmospheric sub-cooler exchanger 1200 a to thesub-cooler compressor 4310 for compression, and a fluid path 4300 b thatcarries the compressed third fluid to the trim condenser 1200 b.Additionally, the third circuit 4300 includes a fluid path 4300 c thatcarries the third fluid from the trim condenser 1200 b to a meteringdevice, or a thermal expansion valve 4311, which expands the third fluidback to the atmospheric sub-cooler exchanger 1200 a. It is envisionedthat the third fluid may continuously flow through the third circuit4300 as long as the third circuit 4300 is activated.

In some embodiments, the third circuit 4300 is activated only when thesecond fluid exceeds its threshold temperature (e.g., 18.9° C.), whichmay occur when the wet-bulb temperature is over 17.2° C. The coolingcapacity of the third circuit 4300 may be regulated in direct proportionto the wet-bulb temperature that is in excess of 17.2° C., asillustrated in Table 1 below,

TABLE 1 WET-BULB COOLING CAPACITY OF THE THIRD TEMPERATURE CIRCUIT 430063 wb (17.2° C.)  0 tons 64 wb (17.8° C.) 13 tons 65 wb (18.3° C.) 26tons 66 wb (18.9° C.) 39 tons 67 wb (19.4° C.) 52 tons 68 wb (20° C.) 65tons 69 wb (20.6° C.) 78 tons 70 wb (21.1° C.) 91 tons

The third circuit 4300 closely controls the temperature of the secondfluid by trimming and cooling the temperature of the second fluid onedegree at a time. For instance, if the second fluid temperature risesabove its threshold temperature by, one degree, the third circuit 4300then reduces the temperature of the second fluid by one degree.

In one embodiment, for efficiency reasons, the second circuit 4200directs a small portion of the second fluid to perform heat exchangewith the third fluid, before the second fluid enters the main condenser1300. Specifically, the second circuit 4200 includes a splitter tee 4210on the fluid path 4200 d before an inlet of the main condenser 1300. Thesplitter tee 4210 diverts a portion of the second fluid, e.g.,approximately one third of the second fluid, to an inlet of theatmospheric sub-cooler exchanger 1200 a. In some embodiments, theportion of the second fluid has a temperature of 22.2° C. at the inletof the atmospheric sub-cooler exchanger 1200 a.

The second circuit 4200 may include another splitter tee 4211 on thefluid path 4200 d upstream from the splitter tee 4210. In conjunctionwith a flow balancing or flow control valve 4200 g positioned in fluidpath 4200 d between splitter tee 4210 and splitter tee 4211, thesplitter tee 4211 allows the portion of the second fluid to flow from anoutlet of the atmospheric sub-cooler exchanger 1200 a hack to the fluidpath 4200 d. At the splitter tee 4211, the portion of the second fluid,e.g., approximately one third of the second fluid, rejoins the remainingportion of the second fluid, e.g., approximately two thirds of thesecond fluid.

The blended second fluid then proceeds to the main condenser 1300. Insome embodiments, the blended second fluid has a temperature ofapproximately 18.9° C. before entering the main condenser 1300.Alternatively, depending upon the degree or percentage opening of theflow control or flow balancing valve 4200 g, flow control or flowbalancing valve 4200 g can allow either complete or partial divergenceof flow from the main condenser 1300 to the atmospheric sub-coolerexchanger 1200 a or force flow in fluid path 4200 d entirely throughmain condenser 1300.

Additionally, for efficiency reasons, the second circuit 4200 may directonly a small portion of the second fluid to perform heat exchange withthe third fluid, after the second fluid exits from the main condenser1300. Specifically, the second circuit 4200 includes a splitter tee 4212on the fluid path 4200 h at the exit of the main condenser 1300. Thesplitter tee 4212 diverts a portion of the second fluid, e.g.,approximately one third of the second fluid, via a fluid path 4200 i tothe trim condenser 1200 b to reclaim heat from the third fluid. In someembodiments, the approximately one third of the second fluid has atemperature of approximately 27.4° C. at an outlet of the trim condenser1200 b.

The second circuit 4200 may include an additional splitter tee 4213 onthe fluid path 4200 h downstream from the splitter tee 4212. Inconjunction with a flow balancing or flow control valve 4200 kpositioned in fluid path 4200 e between splitter tee 4212 and splittertee 4213, the splitter tee 4213 allows the portion of the second fluid,e.g., approximately one third of the second fluid, exiting from the trimcondenser 1200 b to join the rest of the second fluid. At the splittertee 4213, the portion of the second fluid, e.g., approximately one thirdof the second fluid, rejoins the remaining portion of the second fluid,e.g., approximately two thirds of the second fluid. In some embodiments,the blended second fluid has a temperature of approximately 26.4° C. atthe splitter tee 4213. The blended second fluid then together followsthe fluid paths 4200 e, 4200 m towards the exit of the second circuit4200.

Alternatively, depending upon the degree or percentage opening of theflow balancing or flow control valve 4200 k, flow balancing or flowcontrol valve 4200 k can allow either partial or complete divergence offlow from the main condenser 1300 to the trim condenser 1200 b or forceflow in fluid paths 4200 h and 4200 e entirely through main condenser1300.

In some embodiments, the third circuit 4300 does not include theatmospheric sub-cooler exchanger 1200 a or the trim condenser 1200 b.Rather, the third circuit 4300 includes a trim chiller which isconfigured to cool the entire IT data center.

In one embodiment, the second circuit 4200 may exclusively have only onecooling mode, either the simple free-cooling mode or the mechanicalcompressed cooling mode described above.

In another embodiment, the second circuit 4200 may have both of thecooling modes that alternate with each other. For instance, the secondcircuit 4200 switches to the simple free-cooling mode when the wet-bulbtemperature is at or below a threshold temperature, e.g., 17.2° C., andswitches to the mechanical compressed cooling mode once the wet-bulbtemperature exceeds the threshold temperature.

In other embodiments, the two cooling modes cooperate with other, andthe second circuit 4200 may operate in both cooling modes concurrently.In these embodiments, the simple free-cooling mode is always on suchthat the simple free-cooling mode remains active regardless of thewet-bulb temperature. On the other hand, the mechanical compressedcooling mode, e.g., the third circuit 4300, is activated only when thesimple free-cooling mode alone cannot maintain the second fluid at orbelow the threshold temperature, e.g., 18.9° C., such as when thewet-bulb temperature is above the threshold temperature, e.g., 17.2° C.In these embodiments, when the wet-bulb temperature is at or below itsthreshold temperature, the second circuit 4200 relies solely on theatmosphere for cooling. Once the wet-bulb temperature reaches beyond itsthreshold temperature, the third circuit 4300 is activated and iscontrolled to generate cooling capacity in proportion to the wet-bulbtemperature that is in excess of the threshold temperature. It isenvisioned that the third circuit 4300 can be turned on and offautomatically without user intervention. For instance, the atmosphericsub-cooler exchanger 1200 a automatically becomes active or inactive asthe wet-bulb temperature crosses its threshold temperature.

Statistically, the cooling system 4000 operates exclusively in thesimple free-cooling mode for approximately 95% of the operating time.The mechanical compressed cooling mode is turned on for approximately 5%of the operating time. In a geographical area where the wet-bulbtemperature is about 18.3° C., the cooling system 4000 may runexclusively in the simple free-cooling mode virtually all year round andturns on the mechanical compressed cooling mode for less than 0.04% ofthe operating time, if the area has a wet-bulb temperature of about20.6° C., the mechanical compressed cooling mode is active for about 3%of the operating time. In all these scenarios, a traditional, large,oversized cooling electrical infrastructure as in the prior art wouldrely on mechanical compression cycles for about 40-60% of its operatingtime, thus inducing a much higher operation cost than that of thecooling system 4000.

In addition to the second circuit 4200, the fourth circuit 4400 may alsoperform heat exchange with the first circuit 4100. Specifically, thefourth circuit 4400 interfaces with the first circuit 4100 at therefrigerant liquid receiver 4128 where the fourth circuit 4400 condensesand cools the first fluid via a fourth fluid that flows through thefourth circuit 4400. The refrigerant liquid receiver 4128 has asub-cooler coil 4129, which is an evaporator thermally coupled to boththe first circuit 4100 and the fourth circuit 4400.

The fourth circuit 4400 includes a sub-cooler compressor 4410 configuredto compress the fourth fluid and a sub-cooler condenser 1300 a, whichtransfers heat from the fourth circuit 4400 to the second circuit 4200.Both the sub-cooler compressor 4410 and the sub-cooler condenser 1300 aare fluidly coupled to the sub-cooler coil 4129 of the refrigerantliquid receiver 4128.

The fourth circuit 4400 includes a fluid path 4400 a that carries thefourth fluid from the receiver sub-cooler coil 4129 to a suction side ofthe sub-cooler compressor 4410 for compression, a fluid path 4400 b thatcarries the compressed fourth fluid from the sub-cooler compressor 4410to the sub-cooler condenser 1300 a, and a fluid path 4400 c that carriesthe fourth fluid from the sub-cooler condenser 1300 a to a thermalexpansion valve 4420, which expands the fourth fluid and provides theexpanded fourth fluid to the sub-cooler coil 4129.

In some embodiments, the fourth circuit 4400 is automatically turned onand off based on the conditions detected by the refrigerant liquidreceiver 4128. For instance, the fourth circuit 4400 becomes active whenthe liquid level detected by the refrigerant liquid receiver 4128 dropsbelow a predetermined threshold. Specifically, the fourth circuit 4400may be activated in response to an alarm signal generated by the liquidlevel controller 4127 when a low liquid level is detected, and maybecome inactive when the liquid level reaches the predeterminedthreshold. Further, the fourth circuit 4400 may also be controlled basedon the temperature of the first fluid as detected by the refrigerantliquid receiver 4128. For instance, the fourth circuit 4400 may becomeactive when the temperature of the first fluid exceeds a predeterminedthreshold, and become inactive when the temperature drops to or belowthe predetermined threshold.

The second circuit 4200 removes heat from the fourth circuit 4400 at thesub cooler condenser 1300 a. In some embodiments, the second circuit4200 includes a splitter tee 4205 on the fluid path 4200 d. The splittertee 4205 includes a split path 4200 b that diverts a small portion ofthe second fluid, e.g., approximately 19 liters/minute, to an inlet ofthe sub-cooler condenser 1300 a where the small portion of the secondfluid extracts heat from the fourth circuit 4400. The remaining,undiverted portion of the second fluid follows the fluid path 4200 d tothe main condenser 1300 to remove heat from the first circuit 4100.

The second circuit 4200 may also include another splitter tee 4215 onthe fluid path 4200 e. The splitter tee 4215 has a split branch 4200 cthat carries the small portion of the second fluid returned from anoutlet of the sub-cooler condenser 1300 a to the fluid path 4200 e tojoin the rest of the second fluid proceeding towards the exit of thesecond circuit 4200. In one embodiment, the temperature of the secondfluid at the splitter tee 4215 is approximately 26.4° C. when the fourthcircuit 4400 is active, i.e., when the sub-cooler condenser 1300 a isturned on, and approximately 26.7° C. when the fourth circuit 4400 isinactive, i.e., when the sub-cooler condenser 1300 a is turned off.

The close-coupled cooling system 4000 may be installed in an auxiliaryenclosure of a modular data pod and may provide chillerless coolingwithin a data enclosure of the modular data pod in high wet-bulbtemperature applications. For example, the dedicated close-coupledcooling systems 525, 626, 727, 828, 1020, and 828′ of FIGS. 2A-2D and2F-2G, respectively, may include the close-coupled cooling system 4000of FIG. 6.

The operation of the close-coupled cooling system 4000 may be summarizedas follows. In the free-cooling mode of operation, the first coolingcircuit 4100, which includes the liquid receiver 4128 and the liquidrefrigerant pump 4120, and the second cooling circuit 4200, whichincludes the main condenser 1300, are in operation to transfer heat fromthe modular data pods 50, 60, 70, 80, 80′, 90, or 100 described abovevia the fluid supply path 4100 a and fluid return path 4100 b and toreject heat to the environment via the low temperature supply path 4200a and via primary cooling coil cooling water return connection 4200 m.

When the environmental conditions preclude exclusive reliance on thefree cooling mode of operation, e.g., if the wet-bulb temperature is ator exceeds a predetermined wet-bulb temperature limit, or if there is anincrease in the heat load generated within the modular data pods 50, 60,70, 80, 90, 100, or 80′, the close-coupled cooling system 4000 is placedinto an incremental, mechanical-assist cooling mode of operation. In theincremental, mechanical-assist cooling mode of operation, first coolingcircuit 4100 and the second cooling circuit 4200 as described above withrespect to the free-cooling mode of operation continue to remain inoperation while the third cooling circuit 4300, which includes the trimcondenser 1200 b, the sub-cooler exchanger 1200 a, and the sub-coolercompressor 4310, is placed into operation to permit incremental,additional cooling of the modular data pods 50, 60, 70, 80, 90, 100, or80′ such that the cooling capacities of the first, second, and thirdcooling circuits 4100, 4200, and 4300, respectively, are adjustedincrementally depending on the change in heat load from the modular datapods 50, 60, 70, 80, 90, 100, or 80′ and/or any change in environmentalconditions based on the wet-bulb temperature.

In an alternative incremental, mechanical-assist cooling mode ofoperation, the first cooling circuit 4100 and the second cooling circuit4200 as described above with respect to the free-cooling mode ofoperation continue to remain in operation while the fourth coolingcircuit 4400, which includes the sub-cooler condenser 1300 a and thesub-cooler compressor 4410, is placed into operation to permitincremental, additional cooling of the modular data pods 50, 60, 70, 80,90, 100, or 80′ such that the cooling capacities of the first, second,and fourth cooling circuits 4100, 4200 and 4400, respectively, areadjusted incrementally depending on the increase or decrease in heatload from the modular data pods 50, 60, 70, 80, 90, 100, or 80′ and/orany change in environmental conditions based on the wet-bulbtemperature.

When the environmental conditions and/or the heat load from the modulardata pods 50, 60, 70, 80, 90, 100, or 80′ preclude exclusive reliance onthe free-cooling mode of operation together with either one of theincremental mechanical-assist modes of operation, the close-coupledcooling system 4000 is placed into a supplemental, incremental,mechanical-assist mode of operation. In the supplemental, incremental,mechanical-assist node of operation, the first cooling circuit 4100, thesecond cooling circuit 4200, and the third cooling circuit 4300 asdescribed above with respect to the incremental, mechanical-assist modeof operation continue to remain in operation while the fourth coolingcircuit 4400 is placed into operation to permit incremental, additionalcooling of the modular data pods 50, 60, 70, 80, 90, 100, or 80′ suchthat the cooling capacities of the first, second, third, and fourthcooling circuits 4100, 4200, 4300, and 4400, respectively, are adjustedincrementally depending on the increase or decrease in heat load fromthe modular data pods 50, 60, 70, 80, 90, 100, or 80′ and/or anyincrease in environmental conditions based on the wet-bulb temperature.

The cooling system 4000 has many significant advantages over traditionalcooling systems, such as chilled water systems, chiller plants, ordirect expansion cooling systems. First, the cooling system 4000requires far less mechanical-assisted cooling infrastructure thantraditional cooling systems. The cooling system 4000 increases its useof mechanical-assisted cooling infrastructure only when necessary.Specifically, the cooling system 4000 has two basic circuits, i.e., thefirst circuit 4100 and the second circuit 4200, which run constantly,and two backup circuits, i.e., the third circuit 4300 and the fourthcircuit 4400, which run only when necessary. Specifically, the thirdcircuit 4300 is active only when the wet-bulb temperature is above thethreshold temperature, and the fourth circuit 4400 is active only whenthe first fluid liquid level is low or the first fluid temperature isabove a certain threshold. Since the two backup circuits operate onlywhen necessary, e.g., approximately 10-20% of the operating time, thecooling system 4000 overall relies on less mechanical-assisted coolinginfrastructure than the traditional cooling system.

Second, the cooling system 4000 is less prone to failures than thetraditional cooling system. Specifically, the cooling system 4000completely avoids a full system swing over process that is common in thetraditional cooling system. A full system swing over process switchesbetween two systems by shutting down one system and starting up another,which typically happens when the traditional cooling system switchesbetween a free cooling system and a mechanical cooling system. The fullsystem swing over process is dangerous and prone to failures. Thecooling system 4000, on the other hand, avoids the full system overprocess. In the cooling system 4000, the basic circuits and the backupcircuits run independently, yet cooperating with each other. The basiccircuits 4100 and 4200 run continuously regardless of the state of thebackup circuits 4300 and 4400. The backup circuits 4300 and 4400 areturned on only when necessary. Accordingly, the cooling system 4000avoids the failures in the full system swing over process, and is asafer approach than the traditional cooling system.

Third, the cooling system 4000 has a higher tolerance for high wet-bulbtemperatures than the traditional cooling system. The traditionalcooling system generally has a very high operation cost when thewet-bulb temperature is above 10° C. For instance, the maximum wet-bulbtemperature that the traditional cooling system can survive in afree-cooling mode is approximately 10° C. When the wet-bulb temperatureexceeds 10° C., the traditional cooling system must switch from a freecooling system to a mechanical cooling system to provide sufficientcooling to an IT data center. For about every half degree above 10° C.,the mechanical cooling system has to generate an additional coolingcapacity of 91 tons, which demands the traditional cooling system toacquire sufficient power to generate the additional cooling capacity.

On the other hand, the cooling system 4000 of the present disclosure hasa better tolerance for high wet-bulb temperatures. In some embodiments,the maximum wet-bulb temperature that the cooling system 4000 cansurvive in a free-cooling mode is approximately 17.2° C., much higherthan that of the traditional cooling system. Once the wet-bulbtemperature exceeds 17.2° C., the cooling system 4000 switches to themechanical compressed cooling mode. For every half degree above 17.2°C., the mechanical compressed cooling mode generates an additionalcooling capacity of 13 tons, which, in turn, consumes significantly lesspower than the traditional cooling system. Because of its high tolerancefor high wet-bulb temperature, the cooling system 4000 is better suitedfor a high density IT data center, e.g., 40 kW per rack, than thetraditional cooling system.

Fourth, the cooling system 4000 is more energy efficient than thetraditional cooling system. The cooling system 4000 maximizes energysavings by having the simple free-cooling mode which relies onatmosphere to assist cooling the IT data center. In the simplefree-cooling mode, the cooling system 4000 consumes a limited of power,which, for instance, is 15% less than what is required to power thetraditional cooling system. Further, the cooling system 4000 adjusts itspower consumption dynamically as a function of the load in the IT datacenter. As the load increases, the cooling system 4000 increases itspower consumption level to cause an increase in the flow rates in thetwo basic circuits and/or activate one or both of the backup circuits,which, in turn, generate more cooling capacity to compensate for theload increase. By contrast, as the load decreases, the cooling system4000 decreases its power consumption level which, in turn, reduces itsoutput of cooling capacity.

Fifth, the cooling system 4000 is more scalable to the size of the ITdata center and easier deployable than the typical cooling system. Forinstance, the cooling system 4000 can be deployed modularly at specific,targeted locations in an IT data center, in contrast to the typicalcooling system which has to be deployed as a whole covering the fullextent of the IT data center. Due to its modularity, the cooling system4000 targets specific locations in the IT data center and avoidslocations that do not need cooling. Also due to its modularity, thecooling system 4000 can be deployed on existing and retrofit coolingsystems which the typical cooling system fails to do. Further, thenumber of cooling systems 4000 deployed in an IT data center may bescaled according to the dynamic change, e.g., shrink or growth, of theIT data center.

Lastly, the cooling system 4000 has a lower overall cost than that ofthe traditional cooling system. For instance, the cooling system 4000requires relatively low initial capital and maintenance. Further, due toits energy efficiency, the cooling system 4000 has a low operation cost.As a result, the cooling system 4000 is more cost effective than thetraditional cooling system. Because of its overall low cost, in additionto its high tolerance for high wet-bulb temperature, the cooling system4000 is an optimal cooling choice for the high density IT data center,e.g., 40 kW per rack.

Thus, a control strategy is employed to enable close system pressure andflow tolerances utilizing bypass control valves, temperature andpressure sensors, and receiver safeties and pressure regulators. Thiscontrol strategy may be executed in real time and is relational withdynamic control of all components. The control strategy incorporatesfeed back from the IT servers to better facilitate close-coupled coolingbased on real-time individual loading of the rack servers and computerloads.

One of the benefits of the dedicated close-coupled cooling systems(e.g., 525) is that they can adapt to the different heat loads that aregenerated by different servers contained in the modular data pods. As aresult, the dedicated close-coupled cooling systems can operateefficiently. In contrast, traditional cooling systems for data centersand data pod modules are typically designed for and operate at the worstcase conditions for a particular computer design. Also, traditionalcooling systems cool all data pod modules according to the data modulewith the greatest heat load.

FIG. 7 is a schematic diagram of a dedicated close-coupled hybridrefrigerant cooled and water-cooled cooling system for modular datapods. In the exemplary embodiment of FIG. 7, dedicated close-coupledhybrid refrigerant-cooled and water cooled cooling system 525 of FIG. 2Aincorporates cooling system 4000 of FIG. 6, which is illustrated asbeing applied to modular data pod 50 of FIG. 2A in the form of threeindependent and individually-pumped refrigerant cooling coil circuits4001, 4002, and 4003.

The dedicated close-coupled cooling system 525, which may allow forchillerless operation, is housed within an auxiliary enclosure orcompartment 515, as described above with respect to FIG. 2A. Thededicated close-coupled cooling system 525 includes the threeindependent and individually-pumped refrigerant cooling coil circuits4001, 4002 and 4003 that are each similar to the cooling system 4000 ofFIG. 6. For the purposes of clarity, the refrigerant cooling coilcircuits 4001 are illustrated as simplified versions of the coolingsystem 4000 of FIG. 6, but may include each of the features of coolingsystem 4000 of FIG. 6. Those skilled in the art will recognize thatcooling circuits 4002 and 4003 also may include each of the features ofcooling system 4000 of FIG. 6.

Thus, the cooling circuits 4001, 4002, and 4003 may each include thefirst cooling circuit 4100, the second cooling circuit 4200, the thirdcooling circuit 4300, and the fourth cooling circuit 4400 respectively.As described above with respect to FIG. 6, if the wet-bulb temperatureis at or exceeds a predetermined wet-bulb temperature limit, the secondfluid circuit 4200 is placed into operation to sub-cool the first fluidflowing through the first cooling circuit 4100. Operation of the secondfluid circuit 4200 includes operation of the compressor 4310, thesub-cooler exchanger 1200 a and trim condenser 1200 b, and therefrigerant fluid receiver 4128 that is designed to provide stableliquid levels at the inlet to liquid refrigerant pump 4120.

The first circuit 4001 includes fluid supply path 4100 a and fluidreturn path 4100 b that are fluidly coupled to primary cooling verticalcoils 531 to 535, adjacent to rear sides 501 a to 505 a of server racks501 to 505, respectively. Primary vertical coils 531 to 535 are influidic communication with refrigerant gas fluid supply path 4100 a viafirst refrigerant cooling gas supply connection header 4101 a. Therefrigerant gas passes through the primary vertical coils 531 to 535 tocool the server racks 501 to 505, respectively. The refrigerant gas isthen discharged to refrigerant cooling gas return connection header 4101b that is in fluidic communication with the electronic equipment andfluid return path 4100 b described above with respect to FIG. 6.

The second circuit 4002 includes (N+1) secondary cooling vertical coils21 and 22 as described above with respect to modular data pod 10 in FIG.3 plus additional (NH) vertical cooling coils 23, 24, and 25 that arenot explicitly illustrated in FIG. 3. Secondary vertical coils 21 to 25are in fluidic communication with refrigerant gas fluid supply path 4100a via first refrigerant cooling gas supply connection header 4102 a. Therefrigerant gas passes through the secondary vertical coils 21 to 25,which are generally positioned in proximity to server racks 501 to 505to cool the server racks 501 to 505, respectively. The refrigerant gasis then discharged to refrigerant cooling gas return connection header4102 b that is in fluidic communication with the electronic equipmentand fluid return path 4100 b described above with respect to FIG. 6.

Similarly, the third circuit 4003 includes one or more (N+2) coolingcoils, such as third cooling coil 30 that is disposed on the suctionsides of the air circulators 16 a, 16 b, 16 c for further cooling of theair circulating through the air circulators 16 a, 16 b, 16 c, asdescribed above with respect to FIG. 3. In a similar manner, thirdcooling coil 30 is in fluidic communication with refrigerant gas fluidsupply path 4100 a via first refrigerant cooling gas supply connectionheader 4103 a. The refrigerant gas passes through the third cooling coil30 that is generally positioned above server racks 501 to 505 to coolthe server racks 501 to 505, respectively. The refrigerant gas is thendischarged to refrigerant cooling gas return connection header 4103 hthat is in fluidic communication with the electronic equipment and fluidreturn path 4100 b described above with respect to FIG. 6

In general, in conjunction with FIG. 6, in the initial configuration,the first cooling circuit 4001 is in fluidic communication with theprimary vertical cooling coils 531 to 535 and with the cooling watersupply header 2152 a via the primary cooling coil cooling water supplyconnection 4201 a, which is in fluidic communication with the first lowtemperature supply path 4200 a and via the primary cooling coil coolingwater return connection 4200 m, which is in fluidic communication withthe first high temperature return path 4200 m. The primary cooling coilcooling water return connection 4200 m is in fluidic communication witha cooling water return header 2151 b. The cooling water supply header2152 a may also be in fluidic communication with a second cooling watersupply header 2151 a. Similarly, the cooling water return header 2151 bmay also be in fluidic communication with a second cooling water returnheader 2152 b.

As the heat load within the modular data pod 50 increases, the secondary(N+1) vertical cooling coils 21 to 25 can be installed and the secondcooling circuit 4002 is connected to the secondary vertical coolingcoils 21 to 25 and to the cooling water supply header 2152 a via thesecond cooling coil cooling water supply connection 4202 a, which is influidic communication with the first low temperature supply path 4200 a,and via the second cooling coil cooling water return connection 4202 m,which is in fluidic communication with the first high temperature returnpath 4200 m. The second cooling coil cooling water return connection4202 m is in fluidic communication with the cooling water return header2151 b.

As the heat load within the modular data pod 50 further increases, theone or more third (N+2) cooling coils 30 can be installed and the thirdcooling circuit 4003 is connected to the one or more third cooling coils30 and to cooling water supply header 2152 a via third cooling coilcooling water supply connection 4203 a, which is in fluidiccommunication with the first low temperature supply path 4200 a, and viathird cooling coil cooling water return connection 4203 m which is influidic communication with first high temperature return path 4200 m.Third cooling coil cooling water return connection 2313 b is in fluidiccommunication with cooling water return header 2151 b.

Detail 7A in FIG. 7 illustrates that supply header 2151 a can bephysically installed with a loop or pipe bend 2151 a to provide a longertotal length as compared to the alternate supply header 2152 a for thepurposes of providing reverse return capability.

Similarly, return header 2151 b can be physically installed with a loopor pipe bend 2151 b′ to provide a longer total length as compared to thealternate return header 2152 b for the purposes of providing reversereturn capability.

Thus, the first, second, and third cooling circuits 4001, 4002, 4003,respectively, can be installed and operated in a staged or as-neededmanner, in a single modular data pod, depending upon the heat load. Whenthe second and third cooling systems 4002 and 4003 are not used, all ora portion of the fourth fluid in the fluid receiver 4128 may change tothe vapor state. To counter this occurrence, the fourth circuit 4400,which includes the subcooler condenser 1300 a, can be operated tomaintain a liquid level in the refrigerant liquid receiver 4128.

The three refrigerant cooling coil circuits 4001, 4002, and 4003 may use134a (i.e., (i.e., 1,1,1,2-Tetrafluoroethane) refrigerant. In otherembodiments, one or more of the circuits may use other refrigerantsknown to those skilled in the art. Each circuit 4001, 4002, and 4003 hasits own liquid refrigerant pump 4120. Each circuit may also include asecondary or redundant pump (not shown).

FIG. 7 also shows water-cooled condensers 1300. In other embodiments,the cooling system can use air-cooled condensers or other types ofcondensers. Each condenser circuit includes energy-efficient controls tomaintain, optimize, and manage the refrigerant and cooling watercircuits. The cold-water side of the cooling system can use any mediumfor rejecting heat, e.g., air-cooled systems, cooling towers, fluidcoolers, glycol water-cooled system, and geothermal systems.

The control and regulation of the refrigerant temperature is managed bywater-regulating valves that regulate the temperature of the liquidrefrigerant based on a given set point. The cooling system includescontrol logic that monitors the interior conditions of the modular datapods and regulates the cooling system output based on the internaltemperature and specific rack-loading requirements. The deionized wateror refrigerant circuits may each include redundant pumps. The pumps aredriven VFDs and are controlled according to various control strategies.The control strategies may incorporate demand loading at the server andrack locations according to cloud-computing technology.

FIG. 8 is a schematic diagram of an exemplary embodiment of a dedicatedclose-coupled water-cooled cooling system 2400 as applied to modulardata pod 50 showing the flow of cooling water, e.g., deionized(nonconductive) water. Water-cooled cooling system 2400 includes threeindependent and individually pumped deionized water cooling coilcircuits 2401, 2402, and 2403 installed within auxiliary enclosure 515of modular data pod 50. The circuits of FIG. 8 are similar to thecircuits of FIG. 6 except that the dedicated close-coupled cooling watersystem 2000 of FIG. 7 is now replaced in FIG. 8 by a dedicatedclose-coupled cooling water system 2400, which includes heat exchangers,and the cooling system 2400 of FIG. 8 further includes a deionized watersource (not shown) in fluidic communication with a dedicated externalchiller skid 2450 housed within the auxiliary enclosure 515.

The dedicated external chiller skid 2450 is illustrated as including afirst mechanical assist chiller 2451 and a redundant second mechanicalassist chiller 2452. Each of the cooling coil circuits 2401, 2401, and2403 includes a heat exchanger 2420 having a deionized water side 2420 aand a cooling water side 2420 b. On the deionized water side 2420 a,deionized water is discharged from the heat exchanger 2420 via adeionized cooling water supply line 2403 a located within the auxiliaryenclosure 515. The deionized cooling water supply line 2403 a includesredundant pumps 2431 and 2432 having a common pump suction header 2430.Heated water returning from the modular data pod 50 is returned to theheat exchanger 2420 via deionized cooling water return line 2403 b whereheat is exchanged between the deionized water side 2420 a of the heatexchanger 2420 and the cooling water side 2420 b of the heat exchanger2420.

The cooling water side 2420 b of heat exchanger 2420 is in fluidiccommunication with the cooling water supply header 2152 a via a firstcooling water supply line 2410 a 1. The cooling water side 2420 b ofheat exchanger 2420 is also in fluidic communication with the coolingwater return header 2151 b via a first cooling water return line 2410 b1. In a similar manner as described above with respect to Detail 7A ofFIG. 7 Detail 8A shows that the cooling water supply header 2152 a maybe in fluidic communication with a second cooling water supply header2151 a. Similarly, cooling water return header 2151 b may be in fluidiccommunication with a second cooling water return header 2152 b.

The mechanical assist chillers 2451 and 2452 are in fluidiccommunication with the common pump suction header 2430 via a firstdeionized chilled water supply and a return line 2461 that is in fluidiccommunication with an expansion tank 2460. The mechanical assistchillers 2451 and 2452 alternately draw deionized water from theexpansion tank 2460 to remove heat during the cooling phase of operationof the mechanical assist chillers 2451 and 2452 and discharge the cooleddeionized water back to the expansion tank 2460 and pump suction header2430.

Those skilled in the art will recognize that although the deionizedchilled water supply and return are illustrated as occurring in analternating sequence via first chilled water supply and return line2461, the deionized chilled water supply and return can also be effectedvia separate supply and return lines between the mechanical assistchillers 2451 and 2452 and the common pump suction header 2430. In thatcase, the mechanical assist chiller skid 2450 includes separate pumpingcapability (not shown) and separate supply and return lines (not shown)to and from the pump suction header 2430 for a continuous cooling modeof operation.

As described above with respect to the close-coupled cooling system 2000of FIG. 5, the deionized cooling water supply line 2403 a of the firstcooling circuit 2401 is in fluidic communication with the first supplyconnection header 2101 a that generally extends into the modular datapod 50 and is in fluidic communication with primary cooling coils 531 to535. Instead of transporting refrigerant gas, the first supplyconnection header 2101 a transports deionized water through the primarycooling coils 531 to 535, which, in turn, discharge heated deionizedwater to the first return connection header 2101 b that is in fluidiccommunication with the deionized cooling water return line 2403 b.

As described above, the deionized cooling water return line 2403 btransports heat to the deionized water side 2420 a of the heat exchanger2420. The flow of cooling water on the cooling water side 2420 b of theheat exchanger 2420 is controlled by a temperature or flow control valvethat is actuated dependent upon the temperature in the deionized coolingwater supply line 2403 a of the first cooling circuit 2401.

Similarly, the deionized cooling water supply line 2403 a of the secondcooling circuit 2402 is in fluidic communication with the second supplyconnection header 2102 a that generally extends into the modular datapod 50 and is in fluidic communication with secondary cooling coils 21to 25. Again, instead of transporting refrigerant gas, the second supplyconnection header 2102 a now transports deionized water through thesecond cooling coils 21 to 25, which, in turn, discharge heateddeionized water to the second return connection header 2102 b that is influidic communication with the deionized cooling water return line 2403b. Again, the deionized cooling water return line 2403 b transports heatto the deionized water side 2420 a of the heat exchanger 2420.

Also, the deionized cooling water supply line 2403 a of the thirdcooling circuit 2403 is in fluidic communication with the third supplyconnection header 2103 a that generally extends into the modular datapod 50 and is in fluidic communication with one or more third coolingcoils 30. Again, instead of transporting refrigerant gas, the thirdsupply connection header 2103 a transports deionized water through theone or more third cooling coils 30, which, in turn discharges heateddeionized water to third return connection header 2103 b that is influidic communication with deionized cooling water return line 2403 b.Again, deionized cooling water return line 2403 b transports heat to thedeionized water side 2420 a of the heat exchanger 2420.

In a similar manner as described above with respect to FIG. 6, if thewet-bulb temperature is at or exceeds a predetermined limit, one or bothof the mechanical assist chillers 2451 and 2452 are placed intooperation to sub-cool the deionized water flowing through one or more ofthe cooling circuit 2401, 2402, and 2403.

Thus, the first, second, and third cooling circuits 2401, 2401, and2403, respectively, can be installed and operated in a staged oras-required manner in an individual modular data pod depending upon theheat load requirements at a particular time after initial installationof the one or more modular data pods.

The heat rejection can also be accomplished using air-cooled condensersor other types of condensers. The cold water side 2420 b of the systemcan include any medium for rejecting heat, e.g., air cooled, coolingtowers, fluid coolers, glycol water, and geo thermal. The circuits canhave redundant pumps. The control and regulation of the deionized waterloop temperature is managed by the control of regulating valves locatedon the cold side of the heat exchangers. The regulating valves 2415 areopened and closed based on a predetermined set point. The systemincludes control logic that monitors the interior conditions of themodular data pods and regulates the cooling system output based oninternal temperature and specific rack-loading requirements. Portabledeionized water and expansion tanks are used to provide water to thecooling system as needed.

Thus, the data pods can use either deionized water or refrigerantcooling coils. Each set of coils have individual circuits that can beused in tandem (to meet high demands) or as redundant back-up circuits.For example, the data pods can use a primary set of coils for typicalconditions and one or more supplemental sets of coils for otherconditions.

FIGS. 9-11 illustrate a modular data pod 80″ which is similar to thegeneric modular data pod 10 of FIG. 3 with a few differences. Ascompared to the generic modular data pod 10 described above with respectto FIG. 3, the modular data pod 80 as illustrated in FIG. 9 includes anadditional “A-Frame” cooling circuit 2601. In one embodiment, the“A-Frame” cooling circuit 2601 contains a coolant supplied from a firstcooling cycle skid 3001 as discussed below with respect to FIGS. 12 and13. The “A-Frame” cooling circuit 2601 has an “A-Frame” heat exchangerassembly 3400, which is formed partially of cooling coils 3401 ac and3502 a-c, illustrated in FIG. 10, in conjunction with an air circulatorsupport structure 816 illustrated in FIG. 9.

With reference to FIG. 9, the air circulator support structure 816includes air circulators 816 a, 816 b, and 816 c that are configured anddisposed in a manner to induce air circulation in the followingdirection. Cold air in the cold aisle 8002′ flows downwardly from thetop of each server rack 803 a′ or 807 c′ to the bottom of the serverrack. After the air passes through a server, e.g., 813 a′ on a serverrack, e.g. 803 a′, the air passes across a heat exchanger 3214 a, andthen enters a hot aisle 8001′ located between the server rack, e.g. 803a′, and an external wall member 1083′. Subsequently, the air circulatesupwardly into a third volume 8003′ to complete one circulation cycle.The air then recirculates through the “A-Frame” heat exchanger assembly3400 in the same order described above.

The modular data pod 80″ is supported on a support structure 8000′ whichincludes fluid supply paths 2701 a and 2702 a which is part of the firstfluid circuit 2071 and fluid return paths 2702 a and 2702 b which ispart of the second fluid circuit 2702 as explained below with respect toFIGS. 12 and 13.

The modular data pod 80″ also includes cable trays 340 that areexemplarily mounted above the server racks, e.g., 803 a′ and 807 c′. Inone embodiment, the modular data pod 80″ includes a dedicated electricalpower supply, e.g. one or more batteries 832 located at a lower end 811′of the data pod enclosure 108″.

As seen in FIG. 9, the external wall members 1083′ and 1087′ define anaperture 812′ at an upper end 811 of the enclosure 108″. A data podcovering member 812 is configured and disposed in a manner tosubstantially cover the aperture 812′.

FIG. 10 is an upper plan view of the modular data center pod 80″. Themodular data pod 80″ is almost identical to the modular data center pod80′ of FIG. 2G, except that the modular data center pod 80″ includes alesser amount of server racks along each external wall member1081′-1088′. For instance, the elongated external wall member 1083includes server racks 803 a′-c′, and the second end 88 b′ includes twoserver racks 804′ and 806. The server racks may be arranged in a“U”-shape as illustrated in FIG. 10, or other shapes.

Modular data pod 80″ also includes first heat exchangers 3101 a-dmounted above server racks 803 a′, 803 b′, 803 c′, and 804′,respectively. Modular data pod 80″ also includes second heat exchangers3102 a-d mounted above server racks 807 c′, 807 b′, 807 a′, and 806′,respectively.

FIG. 11 is a lower plan view of the modular data center pod 80″illustrating air circulators 816 a and 816 b disposed below centralaisle 850 of the modular data center pod 80″ and configured to force airflow vertically upwards through a sump 852. The cable trays 340 exhibita generally “U-shaped” configuration above the server racks 803 a′-c′,804′, 806′, and 807 a′-c′.

In one embodiment, as illustrated in FIGS. 12-13, the modular datacenter pod 80″ may include two “A-Frame” cooling circuits 2601, 2602.For clarity, odd-numbered reference numerals refer to componentsincluded in the first cooling circuit 2601 and even-numbered referencenumerals refer to components included in the second cooling circuit2602. Installation and operation of the cooling circuits 2601 and 2602need not take place concurrently.

The two cooling circuits 2601, 2602 receive coolants supplied from afirst cooling cycle skid 3001 and a second cooling cycle skid 3002,respectively.

As shown in FIG. 13, each cooling circuit 2601, 2602 includes a firstfluid circuit 2701, 2702, respectively. The first fluid circuits 2701and 2702 are evaporator circuits that utilize R134a or a similarrefrigerant and, in one embodiment, are in thermal fluidic communicationwith the various heat exchangers of the data center assembly 10 or 10′.

Returning to FIG. 12, each of the first fluid circuits 2701, 2702includes a fluid supply path 2701 a, 2702 a and a fluid return path 2701b, 2702 b, both of which are in fluid communication with heatexchangers, e.g. 3101 a-n, by carrying fluid or refrigerant to and fromthe heat exchangers. The heat exchangers, e.g., 3101 a-n, are placed inclose proximity to IT servers or IT racks in the IT data center forproviding close-coupled cooling at the point of load.

The first fluid supply path 2701 a includes a first branch path 2702 a1, which carries coolant or cooling fluid to the first heat exchangers3101 a-n via sub branches 2703 a-n and to the second heat exchangers3102 a-n via sub branches 2704 a-n. The first fluid return path 2701 bcarries coolant from the first heat exchangers 3101 a-n via sub branches2705 a-n back to the first cooling circuit 2601, and carries coolantfrom the second heat exchangers 3102 a-n via sub branches 2706 a-n.

In one embodiment, the first fluid supply path 2701 a includes a secondbranch path 2702 a 2 that supplies coolant to fourth heat exchangers3401 a-n via sub branches 2775 a-n, and then to fifth heat exchangers3502 a-n. The coolant exits the fifth heat exchangers 3502 a-n via subbranches 2776 a-n to the first fluid return path 2701 b via a branchpath 2701 b 2. The coolant removes heat from the fourth and fifth heatexchangers and is converted to a heated fluid as a result.

It is envisioned that the second fluid paths 2702 a-b have similarstructures and functionalities as that of the first fluid paths 2701 a-bto cool heat exchangers 3301 a-n, 3213 a-n, and 3214 a-n.

As the coolant leaves each heat exchanger, the coolant absorbs heat fromthe heat exchanger and becomes heated fluid, which is then delivered tothe inlet of the main condenser 1300 illustrated in FIG. 13 for cooling.

As shown in FIG. 13, the first cooling circuit 2601 includes a coolingsystem similar to the cooling system 10 of FIG. 6. The first fluidsupply path 2701 a and the first fluid return path 2701 b of the firstcooling circuit 2601 are respectively coupled to the first supply path4100 a and the first return path 4100 b of the first circuit 100 of thecooling system. In operation, the first fluid return path 2701 b carriesthe heated fluid to the first return path 4100 b, which delivers theheated fluid to the main condenser 1300 where the heated fluid is cooledand condensed. For purposes of cooling the heated fluid, the maincondenser 1300 may be assisted by the second circuit 4200 and the thirdcircuit 4300.

After the fluid exits from the main condenser 1300, the fluid flows tothe refrigerant liquid receiver 4128 where the liquid level andtemperature of the fluid is measured. If the liquid level is low or ifthe temperature is high, the sub cooler compressor 4410 and the subcooler condenser 1300 a are activated to increase the liquid leveland/or reduce the temperature of the fluid. After the fluid exits fromthe refrigerant liquid receiver 4128, the fluid flows to the liquidrefrigerant pump 4120, which pumps the fluid, now the coolant, to thefluid supply path 4100 a, which then delivers the coolant to the firstfluid supply path 2701 a. The coolant would then be reused to cool theheat exchangers, e.g., heat exchangers 3101 a-n.

Having now received the benefit of the description of cooling system4000 described above with respect to FIG. 12, those skilled in the artwill recognize that cooling systems 4001 and 4002 are simplifiedversions of cooling system 4000.

For extremely high density applications (e.g., greater than 25 kW perrack), a dual-coil (in series) circuit can be utilized. The secondarycoil (e.g., a micro channel coil) receives the coldest refrigerantliquid first. This coil may receive inlet air temperatures less than theinlet temperature to the primary coil (immediately adjacent to the ITracks) (e.g., approximately 6.2° C. less than the inlet temperature tothe primary coil). The liquid and partial vapor leaving the microchannel then enters a simple serpentine single row evaporator coil. Thisserpentine coil is closest to the IT rack. Therefore the serpentine coilreceives the hottest air (e.g., approximately 46.6° C.). The remainingliquid can be boiled off in serpentine coil thereby utilizing the fullheat rejection benefits of latent heat of vaporization principles. Thereare no thermal expansion valves or other pressure metering devices aheadof the coils. Such a dual coil circuit is described in internationalapplication no. PCT/US2011/043893, which was filed on Jul. 13, 2011, andpublished as WO 2012/009460 A2 on Jan. 19, 2012, the entire contents ofwhich are hereby incorporated herein by reference.

FIG. 14 is a schematic diagram of a water-cooled cooling system 3000 fora modular data pod, e.g., modular data pods 10, 50, 60, 70, 80, 90, 100,and 80′ of FIGS. 2A-2G and 3-13. In this embodiment, cooling towersCT-1A, CT-1B, CT-2A, and CT-2B provide the heat rejection to theenvironment for the cooling system 3000. In other embodiments, however,other heat transferring equipment can be used, such as other fluidcoolers and dry coolers. The cooling system also includes dual redundantpipe mains and equipment (pumps and cooling towers).

More particularly, cooled water from cooling towers CT-1A, CT-1B, CT-2A,and CT-2B discharges into a common cooling water supply header 3101.Fully redundant or alternatively half-capacity pumps 3102 a and 3102 arein fluidic communication with the cooling towers CT-1A, CT-1B, CT-2A,and CT-2B via the supply header 3101 and separate cooling water supplyheader branch lines 3101 a and 3101 b such that pump 3102 a drawssuction via branch line 3101 a and pump 3102 b draws suction via branchline 3101 b.

The cooling system 3000 includes a reverse-return pipe circuit on themain pipes and the branch pipes, which connect the modular data pods tothe main pipes. More particularly, in one embodiment of the presentdisclosure, a first modular data pod cooling water supply branch line3103 a is in fluid communication with cooling water supply header branchline 3101 a to supply cooling water to one or more modular data pods 80.Similarly, a second modular data pod cooling water supply branch line3103 b is in fluid communication with cooling water supply header branchline 3101 b to supply cooling water to one or more modular data pods 80.

Cooling water is supplied to one or more modular data pods 80 via asection of the first and second cooling water supply branch lines 3103 aand 3103 b, respectively, that pass through the auxiliary enclosure 818of modular data pod 80.

The first and second modular data pod cooling water supply branch lines3103 a and 3103 b, respectively, are configured and disposed in a“U-shaped” configuration to provide reverse return capability to thecooling water system 3000.

The cooling water that has passed through the auxiliary enclosure 818and has been heated by the equipment in the one or more modular datapods 80 is returned to the cooling towers CT-1A, CT-1B, CT-2A, and CT-2Bvia a section of first and second modular data pod cooling return branchlines 3113 a and 3113 b, respectively. The first and second modular datapod cooling return branch lines 3113 a and 3113 b, respectively, are influidic communication with a common cooling tower water return header3111 and the cooling towers CT-1A, CT-1B, CT-2A, and CT-2B via separatecooling water return header branch lines 3111 a and 3111 b,respectively.

Similarly, cooling water is supplied to one or more modular data pods 80via a section of first and second modular data pod cooling water supplybranch lines 3105 a and 3105 b, respectively, that pass through theauxiliary enclosure 818 of another modular data pod 80.

The first and second modular data pod cooling water supply branch lines3105 a and 3105 b, respectively, are also configured and disposed in a“U-shaped” configuration to provide reverse return capability to thecooling water system 3000.

Again, the cooling water that has passed through the auxiliary enclosure818 and has been heated by the equipment in the one or more modular datapods 80 is returned to the cooling towers CT-1A, CT-1B, CT-2A, and CT-2Bvia a section of the first and second modular data pod cooling returnbranch lines 3115 a and 3115 h, respectively. The first and secondmodular data pod cooling return branch lines 3115 a and 3115 b,respectively, are also in fluidic communication with the common coolingtower water return header 3111 and the cooling towers CT-1A, CT-1B,CT-2A, and CT-2B via the separate cooling water return header branchlines 3111 a and 3111 b, respectively.

In one embodiment, as the need for additional modular data podsincreases, first and second modular data pod cooling water supply branchlines 3103 a and 3103 b, respectively, that pass through the auxiliaryenclosure 818 of modular data pod 80, can be extended as first andsecond modular data pod cooling water supply branch lines 3103 a′ and3103 b′, respectively, to allow for the addition of one or moreadditional modular data pods 80.

The first and second modular data pod cooling water supply branch lineextensions 3103 a′ and 3103 b′, respectively, are configured anddisposed in a “U-shaped” configuration to provide reverse returncapability to the cooling water system 3000.

Similarly, the first and second modular data pod cooling return branchlines 3113 a and 3113 b, respectively, can also be extended as first andsecond modular data return cooling water branch line extensions 3113 a′and 3113 h, respectively, to allow for the addition of one or moreadditional modular data pods 80.

Those skilled in the art will recognize that first and second modulardata pod cooling water supply branch lines 3105 a and 3105 b,respectively, and first and second modular data pod cooling water returnbranch lines 3115 a and 3115 b, respectively, can also be extended in asimilar manner as first and second modular data pod cooling water supplybranch line extensions 3105 a′ and 3105 b′ and first and second modulardata pod cooling water return branch line extensions 3115 a′ and 3115b′, respectively, to allow for the addition of one or more modular datapods 80.

The first and second modular data pod cooling water supply branch lines3105 a and 3105 b, respectively, can also be configured and disposed ina “U-shaped” configuration to provide reverse return capability to thecooling water system 3000.

As can be appreciated from the foregoing description with respect to thereverse return capability, the total path length of the pipe circuitthat connects a modular data pod to the cooling towers is the same foreach modular data pod. This reverse-return feature allows modular datapods to be added to or subtracted from the cooling system withoutrequiring a system shut down of adjacent pods on the circuit oraffecting the operation of adjacent modular data pods. Indeed, thisfeature enables a data site the flexibility of adding and subtractingmodular data pods at will without affecting the overall operation of thecooling system.

The reverse-return feature coupled with the modular capabilities of themodular data pod design according to embodiments of the presentdisclosure allows for the addition, removal, and restacking of modulardata pods with relative ease. Thus, a modular data pod can be installedin a “just in time” manner. Also, the modular data pods require lessupfront infrastructure work and thus lower costs than a typical datacenter having phased loading over time.

FIG. 15 is a schematic diagram of a cooling system 3000′ for lowwet-bulb environments where high \vet-bulb conditions may occasionallyoccur. Cooling system 3000′ is identical to cooling system 3000described above with respect to FIG. 14 except that cooling system 3000further includes a modular chiller 3150 The cooling system 3000 includesthe one or more cooling towers CT-1A, CT-1B, CT-2A, or CT-2B or otherfluid cooler that are effective for low wet-bulb conditions and modularchiller 3150 that is effective for high wet-bulb conditions.

More particularly, modular chiller 3150 provides a bypass around the oneor more cooling towers CT-1A, CT-1B, CT-2A, and CT-2B since the modularchiller 3150 is in fluidic communication with separate first and secondcooling water return header branch lines 3111 a and 3111 b,respectively, via first and second modular chiller suction lines 3131 aand 3131 b, respectively, and with separate first and second coolingwater supply header branch lines 3101 a and 3101 b, respectively, viafirst and second modular chiller discharge lines 3121 a and 3121 b,respectively.

Under high wet-bulb conditions, the modular chiller 3150 is placed intooperation to provide supplemental, external, mechanical-assist coolingto one or more of the modular data pods 80 by injecting cooler waterinto first and second cooling water supply header branch lines 3101 aand 3101 b, respectively.

Cooling system 3000′ could be coupled to a modular data pod hive so thatthe cooling system could operate with little or no need for a separatechiller to cool the water or other cooling fluid.

FIG. 16 is a schematic diagram of a portion of a water-cooled coolingsystem 3110 that includes an existing water-cooled cooling system towhich modular data pods, e.g., modular data pods 80, are coupled. Themodular data pods 80 may be designed to be fed from all kinds ofwater-cooled and refrigerant-cooled cooling systems. The modular datapod structures 80 may be designed to operate on new or existingcondenser water, glycol, geothermal, waste water, or refrigerant coolingsystems.

As shown in FIG. 16, the piping from the modular data pods 80 is coupledto an existing chilled water circuit. In particular, the existingchiller water circuit includes a supply header 3201 and a return header3202. The piping from the data pods may be coupled to the “warmer” or“spent side” of the chilled water circuit on the chilled water returnbecause the modular data pods use cooling air temperatures that arehigher than typical comfort cooling systems. More particularly,water-cooled cooling system 3110 includes a heat exchanger 3161 having achilled water side 3161 a and a modular data pod side 3161 b. Thechilled water side 3161 a is in fluidic communication with existingchilled water return header 3202 via heat exchanger 3161 chilled watersupply line 3160.

The “spent side” water from the chilled water return header 3202 flowsthrough the inlet of chilled water side 3161 a of the heat exchanger3161 via one or more chilled water circulation pumps, e.g., pumps 3162Aand 3162B. The outlet of chilled water side 3161 a of the heat exchanger3161, in which the water is now at an elevated temperature as comparedto the water at the inlet of the chilled water side 3161 a of the heatexchanger 3161, is also in fluidic communication with the chilled waterreturn header 3202 via the pumps 3162A and 3162B and heat exchanger 3161chilled water return line 3163.

The modular data pod side 3161 b is in fluidic communication with one ormore modular data pods 80 via a modular data pod chilled water supplyheader 3165. The modular data pod chilled water supply header 3165 is influidic communication with the modular data pod side 3161 b of the heatexchanger 3161 via one or more modular data supply chilled water supplypumps, e.g., pumps 3164A and 3164B, such that water flows from theoutlet of the modular data supply side 3161 b of the heat exchanger 3161to the modular data pod chilled water supply header 3165. One or moremodular data pods 80 are in fluidic communication with a section ofmodular data pod chilled water supply header branch line 3166 whichpasses through the auxiliary enclosure 818 of modular data pod 80.

The cooling water that has passed through the auxiliary enclosure 818and has been heated by the equipment in the one or more modular datapods 80 is returned to the existing chilled water return header 3202 viaa section of modular data pod cooling return branch line 3167. Themodular data pod cooling return branch line 3167 is in fluidiccommunication the inlet to modular data pod side 3161 b of heatexchanger 3161 via a common heat exchanger modular data supply sideheader 3170.

Similarly, cooling water is supplied to one or more modular data pods 80via a section of modular data pod cooling water supply branch line 3168that passes through the auxiliary enclosure 818 of another modular datapod 80.

Again, the cooling water that has passed through the auxiliary enclosure818 and has been heated by the equipment in the one or more modular datapods 80 is returned to the inlet of the modular data pod side 3161 b ofheat exchanger 3161 via a section of modular data pod cooling returnbranch line 3169. The modular data pod cooling return branch line 3168is also in fluidic communication with the inlet of the modular data podside 3161 b of heat exchanger 3161 via the common heat exchanger modulardata supply side header 3170.

The modular data pod cooling water supply branch lines 3168 and 3168 mayalso be configured and disposed in a “U-shaped” configuration to providereverse return capability to the cooling water system 3110.

The modular data pods can also be fed with chilled water that has beenused for other cooling purposes and is in transit back to the coolingmanufacturing equipment (i.e., the chillers). The data pods may operateat extremely high efficiency levels, and the control system can bemodified to incorporate and take full advantage of system optimizationstrategies. These strategies not only reduce the cost of data pod energyuse, but also reduce the operating costs of the existing chilled-waterplant.

As can be appreciated from the foregoing, referring again to FIGS.2A-2G, in one embodiment, the present disclosure relates to a modulardata pod, e.g., modular data pod 105 in FIG. 2A, modular data pod 106 inFIG. 2B, comprising: an enclosure including wall members contiguouslyjoined to one another along at least one edge of each wall member in theshape of a polygon and a data pod covering member; a plurality ofcomputer racks arranged within the enclosure to form a first volumebetween the inner surface of the wall members and first sides of thecomputer racks and a second volume formed of second sides of thecomputer racks; a computer rack covering member configured to enclosethe second volume, the computer rack covering member and the data podcovering member forming a third volume coupling the first volume to thesecond volume; and an air circulator configured to continuouslycirculate air through the first, second, and third volumes.

As illustrated in FIGS. 17 and 17A, the modular data pods 80 and 180include significant adaptive, expandable, and retractable features thatallow the data pods to be more easily deployed in stages. Moreparticularly, FIG. 17 is a schematic diagram of the data pod farm ormodular data center 1400 of FIG. 1 in an earlier stage of deployment ofthe modular data pod hive 1410 illustrating staged expansion of the datapod farm 1400. As shown, in an initial phase, a partial hive 1410 isdeployed. The data pods 80 and 180 shown via solid lines are data podsthat are deployed in an initial phase with the base infrastructure,which includes pumps, electrical components, and cooling towers. Afterthis initial deployment, more data pods 80 and 180, shown via the dashedlines, and associated support system infrastructure may be added. Also,more cooling towers, pumps, and other equipment for the cooling systemcan be added as the load increases over time.

The physical infrastructure mains pipe and electrical cable) are locatedon one side of the hive. This arrangement reduces the amount of pipeneeded to support the hive. The actual branch mains (i.e., the pipe andelectrical cable for a particular data pod) are included with each datapod thereby reducing the amount of support branch mains installed in thefield and the cost of installing the support branch mains in the field.This also reduces costs significantly.

As shown in FIG. 17, a modular data pod 80 or 180 can be added to orremoved from a data pod hive 1410 or a data pod chain 122, 124, and 126.In particular, each modular data pod 80 includes system components thatallow modular data pods 80 to be added to the data pod hive 1410. Eachmodular data pod 80 includes an auxiliary enclosure 818 containing afluid and electrical circuit section 820. The fluid and electricalcircuit sections 820 may include segments of HVAC pipe and electricalconduits. The segments of the HVAC pipe and electrical conduitscontained in each of the auxiliary enclosures 818 form a fluid andelectrical link positioned internally within the auxiliary enclosures818 between the existing, new, and future modular data pods on themodular data pod chains 122, 124, and 126.

The auxiliary enclosures 818 and their HVAC pipe and electrical conduitsfacilitate staged expansion of a data center without disrupting theoperation of previously deployed modular data pods and correspondingcooling infrastructure. For example, an initial deployment of themodular data center or the modular data pod hive 1410 of FIG. 17 mayhave a central cooling fluid circuit including a central cooling devicesuch as a first pair of cooling towers 131 a and 131 b, supply lines 115a and 115 b, return lines 125 a and 125 b, and a chain of modular datapods 122. Each modular data pod in the chain of modular data pods 122includes an auxiliary enclosure 818 that contains a shared or commonfluid and electrical circuit section 820. Each modular data pod 80 inthe chain of modular data pods 122 also includes a data enclosure 85(see also FIG. 1) that contains at least a portion of an unshared fluidand electrical circuit 822 (shown schematically as dashed linestraversing internally within data enclosure 85) and representing, e.g.,array 840 of vertically disposed upper cooling coils 841, 842, 843, 844,845, 846, 847, and 848 disposed above respective server racks 801, 802,803, 804, 805, 805, 806, 807, and 808 or overhead flat-plate coil 860described above with respect to FIG. 4.

As illustrated in and described above with respect to FIG. 10, cabletrays 340 that are exemplarily mounted above the server racks, e.g., 803a′ and 807 c′, and, as illustrated in, and described above with respectto FIG. 9, a dedicated electrical power supply, e.g., one or morebatteries 832 located at a lower end 811′ of data enclosure 108″ ofmodular data pod 80″, that couples to the shared fluid and electricalcircuit section 820.

Thus, the unshared fluid and electrical circuit 822 includes a coolingfluid circuit, e.g., array 840, that is configured to cool theelectronics contained within the corresponding data enclosure 85. Theshared fluid and electrical circuit sections 820 include first ends 820a and second ends 820 b. The shared or common fluid electrical sections820 are coupled together in series, e.g., second end 820 b of a firstshared fluid and electrical circuit section 820 is coupled to the firstend 820 a of an adjacent second shared fluid and electrical circuitsection 820, to form a fluid and electrical circuit chain 1705.

As illustrated in FIG. 17, adjacent data enclosures on the same side ofthe common fluid and electrical circuit chain 1705, e.g., modular datapods 80, form a pathway providing a user access to an auxiliaryenclosure, e.g., auxiliary enclosure 818.

In conjunction with FIG. 17, FIG. 17A is a detail of an exemplaryembodiment of a plurality 800-1 of modular data pods 80 and 180 whosefluid and electrical circuit sections 820 have first and second ends 820a, 820 a′ and 820 b, 820 b′, respectively, and are coupled together inseries to form a first fluid and electrical circuit 17051 having firstand second ends 820 a and 820 b′, respectively. Modular data pod 180 hasa data enclosure 85 having a configuration that is generally identicalto the configuration of the data enclosure 85 of modular data pod 80.However, since modular data pod 180 is coupled to the first fluid andelectrical circuit section 17051 in an alternating configuration withrespect to modular data pod 80, the connections to supply lines 115 aand 115 b and to return lines 125 a and 125 b of fluid and electricalcircuit sections 820 of auxiliary enclosure 818′ included with modulardata pod 180 are in reverse order, as represented by block 824′, withrespect to the connections to supply lines 115 a and 115 b and to returnlines 125 a and 125 b of fluid and electrical circuit sections 820 ofauxiliary enclosure 818 included with modular data pod 80.

The first shared fluid and electrical circuit 17051 is coupled at afirst end 1710 to the fluid supply lines 115 a and 115 b and the fluidreturn lines 125 a and 125 b of the central cooling fluid circuit 1430.The fluid supply lines 115 a and 115 b and fluid return lines 125 a and125 b may be temporarily coupled at second end 1720 of the shared fluidand electrical circuit chain 1705 via a U-bend or 180° elbow 1750 a and1750 b, respectively, until such time that additional modular data podcapacity is required, as explained below. For simplicity, unlessotherwise noted, reference in the description below to modular data pod80 and auxiliary enclosure 818 is assumed to also apply to modular datapod 80 and auxiliary enclosure 818′.

The shared or common fluid and electrical circuit chain 1705 includes atleast one supply line 115 a and at least one return line 125 a. Thesupply and return lines 115 a and 125 a may be arranged in a reversereturn configuration. For example, each of the shared or common fluidand electrical circuit sections 820 contained within a correspondingauxiliary enclosure 818 may include four supply line segments and tworeturn line segments, (For example, refer to the discussion of Detail 7Ain FIG. 7, which illustrates that supply header 2151 a can be physicallyinstalled with a loop or pipe bend 2151′a to provide a longer totallength as compared to the alternate supply header 2152 a for thepurposes of providing reverse return capability and that, similarly,return header 2151 b can be physically installed with a loop or pipebend 2151 b′ to provide a longer total length as compared to thealternate return header 2152 b for the purposes of providing reversereturn capability).

The shared fluid and electrical circuit sections 820 may be containedentirely internally within the auxiliary enclosure 818, as shown in FIG.7, or portions may extend partially externally beyond the enclosure 818as shown by the shared fluid and electrical circuit section 820 atlocation 1715 in FIG. 17. The pipe chases (not explicitly shown) withinthe auxiliary enclosures 818 of each modular data pod 80 include dualreverse-return pipe circuit segments to provide redundancy in case oneof the pipe circuits fails. These circuits continue the reverse returncapabilities of the cooling system as each new modular data pod isdeployed on a modular data pod chain. This feature enables the additionor removal of modular data pods without shutdowns or costly water systembalancing problems. In other embodiments, the modular data pods includedirect feed mains (versus reverse-return mains) or single, non-redundantmains (e.g., the common cooling fluid circuit includes a single supplyline and a single return line). These modular data pods can be used onTier 1 type facilities where self balancing, reliability, and redundancyissues are less critical.

The pair of cooling towers is fluidly coupled to the central coolingfluid circuit and is configured to support at least a portion of thecooling requirements of the first chain of modular data pods, inparticular, the pair of cooling towers is configured to support all ofthe cooling requirements of the chain of modular data pods underfavorable environmental conditions, e.g., a favorable ambient wet-bulbtemperature.

As described above, each modular data pod includes a data enclosure andan auxiliary enclosure 818. As shown in FIG. 17, the shared fluid andelectrical circuit sections of the auxiliary enclosure are coupledtogether in series to form a linear path. The data enclosures arecoupled to corresponding auxiliary enclosures on alternating sides ofthis linear path. The data enclosure can be shaped and sized so thatadjacent data enclosures on the same side of the linear path form apathway that allows a person to access the auxiliary enclosures. Thedata enclosures can take the shape of a polygon, such as a hexagon or anoctagon. This arrangement of modular data pods provides a data centerwith a very small footprint as compared to traditional data centers. Tofurther increase the data capacity per square foot, the modular datapods may be stacked on top of each other.

After the initial deployment, the modular data center may needadditional data capacity. Thus, in a second stage, a second chain ofmodular data pods and a third chain of modular data pods may be coupledto the central cooling fluid circuit in a manner similar to the initialdeployment of the modular data center 1400. If the first pair of coolingtowers CT-1A and CT-1B do not have sufficient capacity to handle thecooling requirements of the additional chains of modular data pods 80,then a second central cooling device, such as a second pair of coolingtowers CT-2A and CT-2B, may be fluidly coupled to the central coolingfluid circuit in the second stage. In future deployment stages,additional modular data pods may be appended to the first and secondchains 80. In this manner, the modular data center is seamlesslyexpanded over time. Also, as shown in FIG. 17, the central cooling fluidcircuit includes supply and return lines in a reverse-returnconfiguration.

To facilitate the description of the staged expansion of the modulardata farm 1400, FIG. 17B is a simplified block diagram of the modulardata farm 1400 of FIG. 1 and FIG. 17 and of several pluralities of theplurality 800-1 of modular data pods 80 and 180 of FIG. 17A illustratingthe staged expansion of the data pod farm 1400 and of the data pod hive1410 according to embodiments of the present disclosure. Moreparticularly, the blocks designated 800-2, 800-3, 800-4, and 800-5represent pluralities of modular data pods 80 and 180 of FIG. 17A thatare generally identical to the first plurality 800-1 of modular datapods 80 and 180 of FIG. 17A. The block designated 17052 represents afluid and electrical circuit 17052 included by second plurality 800-2 ofmodular data pods 80 and 180. The block designated 17071 represents afluid and electrical circuit 17071 included by third plurality 800-3 ofmodular data pods 80 and 180. The block designated 17072 represents afluid and electrical circuit 17072 included by a fourth plurality 800-4of modular data pods 80 and 180. Similarly, the block designated 17091represents a fluid and electrical circuit 17091 included by a fifthplurality 800-5 of modular data pods 80 and 180.

The blocks designated 1430 and 1430′ are simplified representations ofthe central cooling system 1420 that includes a central cooling fluidcircuit 1430 and a block diagram representation 1430′ of the coolingtowers CT-1A, CT-1B, CT-2A, CT-2B that are included in the centralcooling system 1420.

Referring again to FIG. 17A, in the initial stage of deployment of thedata pod hive 1410, the fluid and electrical circuit sections 820 of thefirst plurality 800-1 of modular data pods 80 and 180 are coupledtogether in series to form first fluid and electrical circuit 17051having a first end 820 a and a second end 820 b′.

Returning to FIG. 17B, the first end 820 a of first fluid and electricalcircuit 17051 is now designated as the first end 820 a 1 and the secondend 820 b′ is now designated as 820 b 1. The first end 820 a 1 iscoupled to the central fluid and electrical circuit 1430. Centralcooling device 1430, as represented for example by one or more ofcooling towers CT-1A, CT-1B, CT-2A, or CT-2B, is coupled to the centralcooling circuit 1430 thereby coupling the first fluid and electricalcircuit 17051 to the central cooling device 1430′.

In the same manner described above with respect to FIG. 17A regardingthe first plurality 800-1 of modular data pods 80 and 180, the fluid andelectrical circuit sections 820 of the second plurality 800-2 of modulardata pods 80 and 180 are coupled together in series to form a secondfluid and electrical circuit 17052 having a first end 820 a 2 and asecond end 820 b 2.

Returning to FIG. 17B, the first end 820 a of the second fluid andelectrical circuit 17052 is now designated as the first end 820 a 2 andthe second end 820 b′ is now designated as 820 b 2. The first end 820 a2 of second fluid and electrical circuit 17052 is now coupled to thesecond end 820 b 1 of the first fluid and electrical circuit 17051thereby coupling the second fluid and electrical circuit 17052 to thecentral cooling device 1430′ and forming a shared fluid and electricalcircuit chain 1705.

In the same manner described above with respect to FIG. 17A regardingthe first plurality 800-1 of modular data pods 80 and 180, the fluid andelectrical circuit sections 820 of the third plurality 800-3 of modulardata pods 80 and 180 are coupled together in series to form a thirdfluid and electrical circuit 17071 having a first end 820 a and a secondend 820 b′.

Returning to FIG. 17B, the first end 820 a of third fluid and electricalcircuit 17071 is now designated as a first end 820 a 3 and the secondend 820 b′ is now designated as 820 b 3. The first end 820 a 3 iscoupled to the central fluid and electrical circuit 1430 therebycoupling the third fluid and electrical circuit 17071 to the centralcooling device 1430′.

Again, in the same manner described above with respect to FIG. 17Aregarding the first plurality 800-1 of modular data pods 80 and 180, thefluid and electrical circuit sections 820 of the fourth plurality 800-4of modular data pods 80 and 180 are coupled together in series to form afourth fluid and electrical circuit 17072 having a first end 820 a and asecond end 820 b′.

Returning to FIG. 17B, the first end 820 a of a fourth fluid andelectrical circuit 17072 is now designated as a first end 820 a 4 andthe second end 820 b′ is now designated as 820 b 4. The first end 820 a4 of the fourth fluid and electrical circuit 17072 is now coupled to thesecond end 820 b 3 of the third fluid and electrical circuit 17071thereby coupling the fourth fluid and electrical circuit 17072 to thecentral cooling device 1430′ and forming a shared fluid and electricalcircuit chain 1707. As illustrated in FIGS. 17 and 17B, the fluid andelectrical circuit chain 1707 may have an interim termination point1711.

Upon increase in the demand for additional modular data pod capability,the shared fluid and electrical circuit chain 1707 may be extended byinstallation of additional pluralities of modular data pods as shown bythe dashed lines in FIG. 17.

Similarly, in the manner described above with respect to FIG. 17Aregarding the first plurality 800-1 of modular data pods 80 and 180, thefluid and electrical circuit sections 820 of the fifth plurality 800-5of modular data pods 80 and 180 are coupled together in series to form afifth fluid and electrical circuit 17091 having a first end 820 a and asecond end 820 b′.

Returning to FIG. 17B, the first end 820 a of fifth fluid and electricalcircuit 17091 is now designated as first end 820 a 5 and the second end820 b′ is now designated as 820 b 5. The first end 820 a 5 is coupled tothe central fluid and electrical circuit 1430 thereby coupling the fifthfluid and electrical circuit 17091 to the central cooling device 1430′and forming fluid and electrical circuit chain 1709. In a similar manneras described above with respect to fluid and electrical circuit chain1707, as illustrated in FIGS. 17 and 17B, the fluid and electricalcircuit chain 1709 may have an interim termination point 1713. Uponincrease in the demand for additional modular data pod capability, thefluid and electrical circuit chain 1709 may be extended by installationof additional pluralities of modular data pods as shown by the dashedlines in FIG. 17.

Those skilled in the art will recognize that, alternatively, the thirdplurality 800-3 of modular data pods 80 and 180 and the third fluid andelectrical circuit 17071 may be installed as the second plurality ofmodular data pods 80 and 180 coupled to the central fluid and electricalcircuit 1430 thereby coupling the now second fluid and electricalcircuit 17071 to the central cooling device 1430′ and forming a fluidand electrical circuit chain 1707 with an interim termination point1711′ similar to the interim termination point 1711. The first fluid andelectrical circuit 17051 now has an interim termination point 1703.

Similarly, the fifth plurality 800-5 of modular data pods 80 and 180 andfifth fluid and electrical circuit 17091 may then be installed as thethird plurality of modular data pods 80 and 180 coupled to the centralfluid and electrical circuit 1430 thereby coupling the third fluid andelectrical circuit 17091 to the central cooling device 1430′ and formingfluid and electrical circuit chain 1709 with interim termination point1713.

FIG. 18 is a schematic diagram and plan view of the data pod farm ormodular data center 1400 and modular data pod hive 1410 of FIG. 1illustrating a transport system 1801 for the modular data pods 80 and180 according to some embodiments of the present disclosure.

As shown in FIG. 18, the data enclosures 85 of the modular data pods 80and 180 may be designed to be removed from modular data pod chain 124using a crane 1805 and placed on a drop-bed tractor trailer 1810 fortransport to another location. The crane 1805 is illustrated moving thedata enclosure 85 of the modular data pod 85 from an initial position1821 within the modular data pod chain 124 to an intermediate position1823 above the drop-bed tractor trailer 1810 to a final position 1825 onthe drop-bed tractor trailer 1810 in preparation for transport away fromthe data pod farm or modular data center 1400. The size of the dataenclosures 85 of the modular data pods 80 and 180 may be scaled down tofit on smaller trucks and railroad flat beds. This scaled-down designdecreases the total output power that the modular data pods can handle.In indoor or outdoor environments or applications, the transport systemmay include overhead gantries, cranes, and rails. If sufficient overheadroom for rigging is not available, the width of the corridors betweenchains of data pods can be increased. This allows fork lifts or othergrade-level rigging apparatus to access the corridors so that the datapods can be easily removed or deployed.

FIG. 19 illustrates the data pod farm or modular data center 1400 andmodular data pod hive 1410 of FIG. 1 in which certain data pods 80 or180 have been removed from the hive 1410 at positions 1901, 1902, 1903,1904, 1905, and 1906, and transported off site so that the removed datapods 80 or 180 can be restacked with new computer systems or servers.The auxiliary enclosure and the fluid and electrical circuit sections,including pipe and electrical chase chambers, remain in place to enablethe data pod envelop or enclosure to be removed, while leaving the pipeand electrical system infrastructure intact to support the adjacent datapods that remain in operation. Thus, this design of the modular data podhive allows modular data pods to be added, removed, modified, andretrofitted without affecting the operation of the remaining data pods.

This design saves time and money because data pods can be removed to aseparate area either onsite or offsite where the data pods are restackedwith new computer systems or otherwise repaired. The restocked data podsmay then be redeployed in the same or different data pod farm. Thisdesign especially saves time and money in cases where the data pod isdeployed in a remote area because there is no need to send a technicianand equipment to the remote area to restack or otherwise repair the datapod. The data pod can simply be transported to a separate area where thedata pod can be restacked or repaired.

FIG. 20 is a schematic diagram and plan view of a large-scale data podfarm 2002. As shown, adjacent data pod farms or modular data centers1400 and 1400′ and respective data pod hives 1410 and 1410′ can bepositioned in mirror-image patterns. The minor-image placement of hivesallows for integration among hives. The hives can be deployed in stagesor phases over time. Each new hive can be connected to the mirror-imagehive adjacent to it in any direction. This community of hives allows forredundancy capabilities within the hive community structure.

As shown, the large-scale data pod farm includes access roads 2005 thatcan be used to serve adjacent hives. As shown in FIG. 20, a mobile craneand/or a tractor trailer or other transport vehicle may gain access tomodular data pods 80 in the modular data pod farm via access roads 2005that surround multiple modular data pod farms 1400 and 1400′.

The overall design of the data pod farm incorporates efficient use ofdata pod shapes and hive patterns to make it possible to deploy a largedata pod farm in three to four times less space than a typical datacenter. This modular approach is far more efficient in its use of overall space versus other containerized modular designs. The data podsthemselves can be much more tightly packed than a typical modularrectangular or square-shaped data pod, such as the data pods in the formof a shipping container. The data pods according to embodiments of thepresent disclosure can be fed from a modular pump house and electricalbuildings, which are also incorporated into a small footprint.

In conjunction with the foregoing discussion of FIGS. 1-20, FIGS. 21Aand 21B illustrate one embodiment of a method 4500 of cooling electronicequipment, e.g., servers 5511 a . . . 511 n and 533 a . . . 533 nillustrated in and described with respect to FIG. 3, using a firstfluid, e.g., a liquid refrigerant R134a or similar refrigerant. Themethod starts at step 4501. In step 4502, the first fluid is free cooledby enabling heat transfer from the first fluid to a second fluid, e.g.,that has been cooled using atmospheric air, as described with respect toFIG. 6, and mechanically cooling the second fluid to the extent thatfree cooling the first fluid is insufficient to cool the first fluid.The mechanical cooling of the second fluid is a function of thetemperature of the second fluid.

In step 4506, the second fluid is cooled before using the second fluidto free cool the first fluid by enabling heat transfer from the secondfluid to a third fluid. In step 4508, the third fluid is compressed viasub cooler compressor 4310 in the third circuit 4300 of FIG. 6. In step4510, the compressed third fluid is condensed by enabling heat transferfrom the compressed third fluid to the second fluid via the trimcondenser 1200 b after using the second fluid to free cool the firstfluid. More particularly, the compressed third fluid is condensed bytrim condenser 1200 b.

In step 4512, the pressure of the condensed third fluid is reduced,e.g., via thermal expansion valve 4311, to reduce the temperature of thethird fluid. In step 4514, the wet-bulb temperature of the atmosphericair is sensed. In step 4516, the speed of compressing the third fluid,e.g., via sub cooler compressor 4310, is varied as a function of thesensed wet-bulb temperature to vary the temperature of the second fluid.

In step 4518, the free-cooled first fluid is received in a fluidreceiver, e.g., fluid receiver 4128. In step 4520, the liquid level ofthe first fluid contained in the fluid receiver 4128 is sensed, e.g.,via liquid level controller 4127.

In step 4522, the first fluid is mechanically cooled to condense thefirst fluid when the sensed liquid level in the fluid receiver 4128falls below a first predetermined level. The mechanical cooling of thefirst fluid may be performed by fluid circuit 4400 via sub coolercompressor 4410 causing a fourth fluid to flow through sub cooler coil4129 of the refrigerant liquid receiver 4128 into subcooling condenser1300 a. In step 4524, the mechanical cooling is deactivated, e.g., byterminating operation of the sub cooler compressor 4410, when the sensedliquid level in liquid receiver 4128 reaches a second predeterminedliquid level that is higher than the first predetermined liquid level.

In step 4526, the first fluid in the fluid receiver 4128 is cooled byenabling heat transfer from the first fluid in the fluid receiver 4128to a fourth fluid. In step 4528, the fourth fluid is compressed, e.g.,via sub cooler compressor 4410. In step 4530, the compressed fourthfluid is compressed by enabling heat transfer from the compressed fourthfluid to the second fluid that has been cooled using atmospheric air. Instep 4532, the pressure of the condensed fourth fluid is reduced, e.g.,via the fourth fluid exiting the sub cooler condenser 1300 a to athermal expansion valve 4420, which expands the fourth fluid back to thesub cooler coil 4129 to reduce the temperature of the fourth fluid.

The first fluid, the third fluid, and the fourth fluid may contain arefrigerant such as R134A and the second fluid contains water, e.g.,condenser water, chilled water, or a glycol solution.

The method 4500 may also include sensing the temperature of thefree-cooled first fluid in first cooling circuit 4100 and regulating theflow rate of the second fluid in second cooling circuit 4200 as afunction of the temperature of the free-cooled first fluid, e.g., viathe temperature sensor 4126 detecting the temperature of the first fluidwhen it exits from the main condenser 1300. The readings of thetemperature sensor 4126 reflect the temperature of the main condenser1300. The method 4500 ends at step 4534.

FIGS. 22A-22C illustrate a method 4600 of deploying modular data pods toform a data center according to one embodiment of the presentdisclosure. More particularly, in conjunction with FIGS. 1, 17, 17A, and17B, method 4600 starts at step 4601. In step 4602, a first plurality800-1 of fluid and electrical circuit sections 820 of a respectiveplurality of modular data pods, e.g., modular data pods 80 and 180, arecoupled in series to form a first fluid and electrical circuit 17051having a first end 820 a 1 and a second end 820 b 1. In step 4604, thefirst end 820 a 1 of the first fluid and electrical circuit 17051 iscoupled to central fluid and electrical circuit 1430. In step 4606, acentral cooling device, e.g., cooling towers CT-1A, CT-1B, CT-2A, orCT-2B, is coupled to central fluid and electrical circuit 1430 therebycoupling the first fluid and electrical circuit 17051 to the centralcooling device, e.g., cooling towers CT-1A, CT-1B, CT-2A, or CT-2B,where the cooling device is configured to satisfy at least a portion ofthe cooling requirements of the plurality of modular data pods 80 and180.

The first fluid and electrical circuit 17051 includes at least one fluidsupply line and at least one fluid return line, e.g., fluid supplyheaders 2151 a, 2152 a and 2151 b, 2152 b, respectively, as shown forexample in FIG. 7. As previously described with respect to FIG. 7, thefluid supply headers 2151 a, 2152 a and fluid return headers may beconfigured in a reverse-return configuration.

Referring again to FIGS. 22A-22B, in step 4608 a second plurality 800-2of fluid and electrical circuit sections 820 of a respective pluralityof modular data pods, e.g. modular data pods 80 and 180, are coupled inseries to form a second fluid and electrical circuit 17052 having afirst end 820 a 2 and a second end 820 b 2.

In step 4610 of FIG. 22A, the first end 820 a 2 of the second fluid andelectrical circuit 17052 is coupled to the first end 820 b 1 of thefirst fluid and electrical circuit 17051 thereby coupling the secondfluid and electrical circuit 17052 to the central cooling device, e.g.,cooling towers CT-1A, CT-1B, CT-2A, or CT-2B.

In step 4612, a third plurality 800-3 of fluid and electrical circuitsections 820 of a respective plurality of modular data pods, e.g.modular data pods 80 and 180, are coupled in series to form a thirdfluid and electrical circuit 17071 having a first end 820 a 3 and asecond end 820 b 3.

In step 4614, the first end 820 a 3 of the third fluid and electricalcircuit 17071 is coupled to the central fluid and electrical circuit1430 thereby coupling the third fluid and electrical circuit 17071 tothe central cooling device, e.g., cooling towers CT-1A, CT-1B, CT-2A, orCT-2B, where the cooling device is configured to satisfy at least aportion of the cooling requirements of the plurality of modular datapods 80 and 180.

In step 4616, a fourth plurality 800-4 of fluid and electrical circuitsections 820 of a respective plurality of modular data pods, e.g.modular data pods 80 and 180, are coupled in series to form a fourthfluid and electrical circuit 17072 having a first end 820 a 4 and asecond end 820 b 4.

In step 4618, the first end 820 a 4 of the fourth fluid and electricalcircuit 17072 is coupled to the second end 820 b 3 of the third fluidand electrical circuit 17071 thereby coupling the fourth fluid andelectrical circuit 17072 to the central cooling device, e.g., coolingtowers CT-1A, CT-1B, CT-2A, or CT-2B, where the cooling device isconfigured to satisfy at least a portion of the cooling requirements ofthe plurality of modular data pods 80 and 180.

In step 4620, a fifth plurality 800-5 of fluid and electrical circuitsections 820 of a respective plurality of modular data pods, e.g.,modular data pods 80 and 180, are coupled in series to form a fifthfluid and electrical circuit 17091 having a first end 820 a 5 and asecond end 820 b 5.

In step 4622, the first end 820 a 5 of the fifth fluid and electricalcircuit 17091 is coupled to central fluid and electrical circuit 1430thereby coupling the fifth fluid and electrical circuit 17091 to thecentral cooling device, e.g., cooling towers CT-1A, CT-1B, CT-2A, orCT-2B, where the cooling device is configured to satisfy at least aportion of the cooling requirements of the plurality of modular datapods 80 and 180.

The central cooling device is a first central cooling device, e.g.,cooling tower CT-1A, CT-1B, CT-2A, CT-2B, as illustrated in FIGS. 14,15, and 17, if one of the cooling towers CT-1A, CT-1B, CT-2A, CT-2Bcannot satisfy at least a portion of the cooling requirements of thesecond plurality of modular data pods 80, the method 4600 includescoupling a second central cooling device CT-1A, CT-1B, CT-2A, CT-2B tothe central fluid and electrical circuit.

Each modular data pod of the plurality of modular data pods 80 includesa data enclosure, e.g. data enclosure 108 of modular data pod 80 in FIG.2D, and an auxiliary enclosure, e.g., auxiliary enclosure 818 in FIG.2D, containing a respective shared fluid and electrical circuit section820. The shared fluid and electrical circuit sections 820 are coupledtogether to define fluid and electrical circuit chains 1705, 1707, or1709 forming a linear path, e.g., chains 122, 124, 126 in FIG. 17. Themethod 4600 further includes coupling the data enclosures 85 to theauxiliary enclosures 818 on alternating sides of the shared fluid andelectrical circuit 1705, 1707, or 1709, as illustrated in FIG. 17. Themethod ends at step 4624.

FIGS. 22D-22E illustrate an alternate embodiment of the method 4600 ofdeploying modular data pods to form a data center according to oneembodiment of the present disclosure. More particularly, in conjunctionwith FIGS. 1, 17, 17A, and 17B, method 4600′ starts at step 4601′. Instep 4602, a first plurality 800-1 of fluid and electrical circuitsections 820 of a respective plurality of modular data pods, e.g.,modular data pods 80 and 180, are coupled in series to form a firstfluid and electrical circuit 17051 having a first end 820 a 1 and asecond end 820 b 1. In step 4604, the first end 820 a 1 of the firstfluid and electrical circuit 17051 is coupled to a central fluid andelectrical circuit 1430. In step 4606, a central cooling device, e.g.,cooling towers CT-1A, CT-1B, CT-2A, or CT-2B, is coupled to the centralfluid and electrical circuit 1430 thereby coupling the first fluid andelectrical circuit 17051 to the central cooling device, e.g., coolingtowers CT-1A, CT-1B, CT-2A, or CT-2B, where the cooling device isconfigured to satisfy at least a portion of the cooling requirements ofthe plurality of modular data pods 80 and 180.

The first fluid and electrical circuit 17051 includes at least one fluidsupply line and at least one fluid return line, e.g. fluid supplyheaders 2151 a, 2152 a and 2151 b, 2152 b, respectively, as shown forexample in FIG. 7. As previously described with respect to FIG. 7, thefluid supply headers 2151 a, 2152 a and fluid return headers may beconfigured in a reverse-return configuration.

In step 4608′, a second plurality 800-3 of fluid and electrical circuitsections 820 of a respective plurality of modular data pods, e.g.,modular data pods 80 and 180, are coupled in series to form a secondfluid and electrical circuit 17071 having a first end 820 a 3 and asecond end 820 b 3.

In step 4610′, the first end 820 a 3 of the second fluid and electricalcircuit 17071 is coupled to the central fluid and electrical circuit1430 thereby coupling the second fluid and electrical circuit 17071 tothe central cooling device, e.g., cooling towers CT-1A, CT-1B, CT-2A, orCT-2B, where the cooling device is configured to satisfy at least aportion of the cooling requirements of the plurality of modular datapods 80 and 180.

In step 4612′, a third plurality 800-5 of fluid and electrical circuitsections 820 of a respective plurality of modular data pods, e.g.,modular data pods 80 and 180, are coupled in series to form a thirdfluid and electrical circuit 17091 having a first end 820 a 5 and asecond end 820 b 5.

In step 4614′, the first end 820 a 5 of the third fluid and electricalcircuit 17091 is coupled to the central fluid and electrical circuit1430 thereby coupling the third fluid and electrical circuit 17091 tothe central cooling device, e.g., cooling towers CT-1A, CT-1B, CT-2A, orCT-2B, where the cooling device is configured to satisfy at least aportion of the cooling requirements of the plurality of modular datapods 80 and 180. Finally, the method 4600′ ends in step 4616′.

The modular data pods of the present disclosure may be designed to usehigher cooling temperatures than standard comfort cooling temperatures(e.g., above 75° F. at the inlet to the pod). The pods can use coldwater (e.g., deionized water), refrigerant, a hybrid of cold water andrefrigerant, or cold air to maintain the cooling temperature at a higherlevel than typical comfort cooling temperatures. The temperature of thecooling air (or other cooling fluid) may be maintained safely above thedew point temperature within the modular data pod envelop to protectagainst condensation.

The modular data pods may include one or more humidifiers and anassociated controller to maintain the humidity of the air internal tothe modular data pod at a desired level. The one or more humidifiers maybe housed in an adjacent pump chamber so as to separate the watermanagement system (e.g., leak control) from the other systems associatedwith the modular data pod. The pods may also control the humidity of theinternal air using a combination of humidifiers or other methods thatuse water or steam.

A data center including multiple modular data pods can be deployed withless base infrastructure than a typical stick-built data center. Thissaves upfront costs for sites that are not intended to have a high dataload in early deployment phases. The systems are scalable and requirefar less infrastructure for the initial deployment.

Most of the components on the electrical, mechanical, and ITinfrastructure systems can be integrated into prefabricated supportstructures, which significantly reduce the amount of time and money ittakes to deploy a data pod system in the field.

The designs of the cooling systems and the modular data pods provide theflexibility to adjust to the tier-specific needs of an intended datacenter project. Large deployment systems such as warehouse hives andfarm hives are designed to have expandable features that allow thesystem to expand in tier capability should it become necessary to do soover time. The methodology to increase the system tier capability overtime is referred to as shared hives. The basic system design includesvalve components and emergency control strategies that enable the systemto be fed from cooling sources in adjacent hives. This hive interlockingfeature enables modular data pods to be fed from supplemental coolingsources if necessary.

The cooling process (cycle) provided by cooling system 10 enables closetolerances in approach temperatures between atmospheric conditions(wet-bulb temperature) and the entering air temperatures to IT rackcooling. The cycle is designed to utilize environmental conditions (lowwet-bulb temperatures) to fully handle rack cooling load whenenvironmental conditions permit. It also includes a back up system ofsubcooling processes that enable the system to handle the cooling loadsin spite of spikes in wet-bulb temperatures. This is accomplished byoptimizing to the specific heat characteristics of the cooling media(R134a) or other refrigerants.

The indirect cooling cycle provided by the cooling system 10 is capableof maintaining IT rack inlet temperature utilizing a sub-cooler systemthat can be sized to less than about 15% of what would normally berequired for either DX or chiller capacity.

The modular data pod is designed to be added to or removed from a datapod hive or a data pod chain. In particular, each modular data pod isdesigned to include system components that allow the modular data pod tobe added to the hive. The HVAC pipe and electrical conduits describedabove are included in each modular data pod to form a link betweenexisting, new, and future modular data pods on the modular data podchain.

The pipe chase of each modular data pod includes dual reverse-returnpipe circuits. These circuits are intended to continue the reversereturn capabilities of the system as each new modular data pod isdeployed on a modular data pod chain. This feature enables the additionor removal of pods without shutdowns or costly water system balancingproblems. Alternatively, the modular pods may include direct feed mains(versus reverse-return mains) or single, non-redundant mains. These podscan be used on Tier 1 type facilities where self balancing, reliability,and redundancy issues are less critical.

Each fluid or pipe circuit is fitted with valves and appurtenancesneeded to deploy the pipe circuit, fill the pipe circuit withsite-specific operating fluid, and commission the pipe circuit. Thesystem may incorporate a strict process that allows the reverse-returncircuits to be continued or extended. The process includes filling,venting (burping), and hydrostatically testing the circuit before themodular data pod is introduced to the system of modular data pods. Thisprocess duplicates the hydrostatic or pneumatic fitness testing that isdone in the factory to ensure that the pipe circuit is not compromisedin transit or during deployment. This allows a modular data pod to beadded seamlessly to a data pod system without affecting the operation ofadjacent modular data pods, or causing costly unintended shutdowns.

The end unit on each pod chain includes a bypass tee arrangement on eachof the two reverse-return circuits. This enables future expansion ofpods to the data pod chain without shutting down the previous data podson a data pod chain.

Each data pod chain in a data pod hive is designed to include integralbut fully-detachable dual pipe, electrical, and IT system infrastructurelocated, for example, in the lower section of the modular data pod. Thismechanical/electrical chase section is designed to be isolated from themain data pod envelop. The rear section or auxiliary enclosure isdetachable from the main pod assembly to enable the data envelop orenclosure to be removed. The modular data pod may be periodicallyremoved to an off-site location to restack the computer servers or tomaintain or upgrade the mechanical, electrical, or control systems ofthe modular data pods. The pipes and conduits may include attachmentmechanisms (e.g., flange or break-away bolts or wiring harness plugs) tofacilitate easy detachment and re-attachment of the pipes and conduitsto the modular data pod assembly. The pipe and conduit chase may includewalls, membranes, and sealants to provide a water-tight seal between thechase and the modular data pod envelop.

When modular data pods 80 are installed in outdoor environments, thepipe circuits of each modular data pod 80 may include heat tracing,insulation, and insulation protection. Each modular data pod may haveits own heat tracing panel that is fully integrated with the BMS, whichmay provide alarm and status information.

Each pod may include leak containment pans below each coil bank. Thepans may include leak detectors that are linked to the BMS. The BMS maytrigger an alarm or otherwise notify an operator when a leak or otherabnormal condition (e.g., high humidity within the modular data centerenvelop) is detected.

Each pod may be fitted with leak detection sensors that can be deployedat strategic points within the modular data center envelop, the pump,the heat exchanger chamber, and the detachable pipe/electrical chamber.The leak detection system may be fully integrated with the BMS, whichcan provide alarm and status information.

The modular data pods are designed to handle high density serverequipment, such as fully redundant 40 kW server racks. The modular datapod design is sealable to accommodate increased power output per cubicfoot of server equipment as a result of advances in server technology.Scaling the modular data pod design may require refitting the heatexchanger and pumping equipment and the power distribution to the serverracks. The extent of any modifications made to scale the modular datapod design may depend on the amount of increase in power output.

The modular data pod cooling mains may be steel pipe, Polyvinyl chloride(PVC) pipe, stainless steel pipe, copper pipe, fiberglass pipe,reinforced concrete pipe (RCP), or other types of pipe. The type, gauge,strength, and thickness of the pipe depend on the requirements of aparticular data pod system.

The modular data pods may be either mass produced or individually custommade to meet given specifications.

The modular approach, which involves building and deploying modular datapods and modular pumping and electrical equipment, is a cost-effectiveway to build data centers. For example, the modular approachsignificantly reduces field labor costs and risks because field labor isonly needed to install and deploy the modular data pods and the modularpumping and electrical equipment.

Energy costs can be reduced by installing modular data pods according tothe present disclosure in a warehouse or similar facility. This isbecause the space within each modular data pod envelop is the only spacewithin the warehouse that requires conditioning. The warehouse spaceoutside each modular data pod requires minimum ventilation. This issignificant because the modular data pods are designed to save space bytheir small physical foot print. Thus, the warehouse or similar facilitycan be smaller.

A typical data center requires a minimum foot print to treat the air inthe hot and cold aisles defined by server rack assemblies that arespread out across a data center floor. For example, a 10,000 square footdata center may house approximately 200-220 server racks. Each rack mayhave the ability to generate on average between 6 and 12 kW. Some rackscan generate higher outputs, e.g., 16-24 kW. In contrast, the modulardata pod according to some embodiments of the present disclosure canattain high enough levels of heat rejection to cool eight server racksconsuming over 40 kW in a relatively small physical footprint.

The tight circular configuration of server racks in embodiments of themodular data pod results in reduced energy costs because less energy isneeded to cool the relatively small air space within the modular datapod. Also, because of the tight configuration of server racks and aislecontainment, the modular data pod needs less fan horse power for airflowpattern control.

The modular data pods can be fed from modular pumping pods that getfluid from cooling towers, fluid coolers, chillers, geothermal systems,or existing building or plant water systems.

The geometric shape of the modular data pod container in conjunctionwith the circular configuration of the server racks provides efficientuse of space and creates natural hot aisle/cold aisle containment andnatural “chimney effect” for hot air pattern control.

An additional benefit of the all inclusive modular design allows for agreater amount of security and compartmentalization for deployment in“cooperative”-type data warehouses and suites. The modular box createssegregation from other IT server racks within the cooperative. The boxescan be locked and easily monitored for security purposes.

The tight, circular configuration of server racks within the modulardata pod facilitates much tighter groupings of interrelated servers andIT equipment, e.g., parent/child, master/slave, and redundant servers.This tight configuration allows for shorter fiber and cable runs betweenIT interdependent components.

The tight packing of the actual modular data pods into a hive allows forshorter cabling and fiber run lengths than would be needed in a normaldata floor build out. The hive structure can be purposefully patternedto allow interdependent IT systems to be efficiently grouped indeployment. These interdependent groupings may reduce cabling and fiberlengths. These reductions not only reduce labor and material costs, butalso reduce operating costs because of shorter data cable runs.

The modular data pods may include real-time data monitoring serverscapable of producing real-time monitoring of critical IT loading, ITstatus, cooling, and power system performance. The modular data pods mayalso include external touch pad system status and monitoring displaypanels.

The modular data pods can also be scaled down in physical sizes for lowrack density applications. Smaller applications can utilize pentagon,hexagon, or other polygonal shapes that are more beneficial in smallermodular data pods.

Embodiments of the modular data pod design, either taken individually orin a system, provides a cost benefit over typical data centers that arestick built. The cost of a partial or full-system deployment of modulardata pods may be at least 30% less than stick-built or site-built datacenters.

The deployment of modular data pods needs far less on-site man hours forconstruction. This significantly reduces the overall schedule for a datacenter project, especially data center projects in remote locations.

The pipe, IT fiber conduits, and electrical chase containment area isfully detachable from the main data pod assembly. The chase can befitted with leak detection and leak control measures that isolate thewater systems transport lines from the actual IT data pod envelop. Thereis no “mixed space” use of data areas and cooling water. The modulardata pods may include either refrigerant loops or deionized waterapplications. No external cooling water (other than deionizednon-conductive water if water application is used) enters the actualdata pod envelop.

The modular data pods can be coupled to cooling systems that useinnovative control strategies to attain high efficiencies. The coolingsystem can use innovative control strategies that allow it to operate atextremely high efficiencies for data center power use standards. Thesystem may use control strategies that allow it to operate at 1.1 RUElevels for areas or zones that have beneficial wet-bulb conditions.

For environments that experience unfavorable wet-bulb conditions, thecooling systems can include a chiller to assist the water-cooled coolingsystem when the wet-bulb conditions deteriorate to the point where thesystem load can no longer be handled by atmospheric conditions.

The data pods may be fed electrical power via home-run conduits,cable-bus duct, or standard-bus duct, at either low or medium voltage.The electrical infrastructure may be built into each pod and have theability to be expandable and adaptable if it or an adjacent pod is addedto or removed from a pod chain.

Each modular data pod may include its own uninterruptible power supply(UPS) or the ability to connect to a UPS main system, e.g., for largedeployment applications. The pods may be fed with dual redundant UPSs,such as the rotary style or the static type UPSs. The pods may also beconfigured to receive transformers and chargers. The transformers, UPS,one or more batteries, and distribution panels may be housed incompartments external to the actual data pod envelop.

As described above, the base of the pod can be fitted with one or moreback-up batteries for emergency power. The pods can also be fitted withan interior ring-type electrical bus carrier similar to a plug in anelectric bus. Each pod can have a charger capable of recharging the oneor more batteries. The one or more back-up batteries may be charged viaalternative or green energy feeds. The interstitial space between racksmay be used to incorporate the power and data patch plug points for eachcomputer rack.

The pod electrical connectors between the main bus feed and the modulardata pod envelop may be removable and allow the pods to be disconnectedfrom the main bus feed to allow removal and redeployment of podenvelops. Each modular data pod may incorporate DC diode decouplingcapabilities.

The pods will have the ability to be illuminated on the exterior withcolor-coded light (e.g., a LED or fiber optic light). The color andintensity of the light may depend on the type and density of theoperating load.

The pod electrical systems can be adaptable depending on the specifictier requirements for a given data center project, e.g., Tiers 1-4.

The battery circuiting can be modified to include adjacent pod batterybackup capabilities should it be required for a specific project.

The pods may feature custom removable computer racks. The computer racksmay be designed to be adaptable so as to be capable of handling bothsmall and large server support loading. The computer racks will alsohave features to allow the servers to be tilted to provide a hot airpattern at the back of the computer rack (e.g., server rack) that is anupward flow pattern. The computer racks may handle servers that haverear and side-blow airflow patterns.

The modular data pods may include water and British Thermal Unit (BTU)meters for operating, monitoring, and controlling the cooling system.The modular data pods may include a control system and all of thenecessary control panels and components to control, monitor, andoptimize the modular data pod and associated systems.

The modular data pods may be capable of tying into the smart grid systemand use cloud computing technology for load shedding and redirection ofprocessing information to alternative pods and offsite data collectionsites.

The modular data pods can be sealed or unsealed. Sealed pods may includeor be coupled to equipment that creates a vacuum within the pod orchanges the composition of the air within the pod (e.g., removal ofoxygen) to increase heat transfer and suppress fire.

While several embodiments of the disclosure have been shown in thedrawings and/or described in the specification, it is not intended thatthe disclosure be limited to these embodiments. It is intended that thedisclosure be as broad in scope as the art will allow and that thespecification be read likewise. Therefore, the above description shouldnot be construed as limiting, but merely as exemplifications ofparticular embodiments. Those skilled in the art will envision othermodifications within the scope and spirit of the claims set forth below.

1. A cooling system for electrical equipment, comprising: a firstcooling circuit including a primary cooling device; a heat exchangemember coupled to the first cooling circuit; and a second coolingcircuit coupled to the heat exchange member and configured to cool theelectrical equipment, the second cooling circuit including a secondarycooling device configured to cool fluid flowing through the secondcooling circuit.
 2. The cooling system according to claim 1, wherein thesecondary cooling device is configured to cool a portion of a heat loadassociated with the electrical equipment that the primary cooling devicecannot cool.
 3. The cooling system according to claim 1, wherein thesecondary cooling device is configured to cool the portion of the heatload associated with the electrical equipment as a function of theatmospheric conditions.
 4. The cooling system according to claim 1,wherein the first cooling circuit and the second cooling circuit areindependent cooling circuits.
 5. The cooling system according to claim1, further comprising primary cooling coils in thermal communicationwith the electrical equipment.
 6. The cooling system according to claim1, wherein the secondary cooling device is a mechanical cooling deviceconfigured to operate when the wet bulb temperature of the atmosphereassociated with the environment of the electrical equipment exceeds apredetermined wet bulb temperature.
 7. The cooling system according toclaim 6, wherein the mechanical cooling device includes a compressiondevice configured to compress fluid flowing through the second coolingcircuit.
 8. The cooling system according to claim 1, wherein the fluidflowing through the first cooling circuit is a glycol solution or waterand wherein the fluid flowing through the second cooling circuit is arefrigerant.
 9. The cooling system according to claim 1, furthercomprising: a second heat exchange member coupled to the first coolingcircuit; and a third cooling circuit coupled to the second heat exchangemember and configured to cool the electrical equipment, the thirdcooling circuit including a second secondary cooling device configuredto cool fluid flowing through the third cooling circuit.
 10. The coolingsystem according to claim 9, further comprising secondary cooling coilsin thermal communication with the electrical equipment.
 11. The coolingsystem according to claim 1, wherein the primary cooling device is afree-cooling device.
 12. The cooling system according to claim 11,wherein the free-cooling device includes a fluid cooler or a coolingtower.
 13. The cooling system according to claim 1, further comprising athird cooling circuit coupled to the second cooling circuit, the thirdcooling circuit including a cooling fluid source and an expansion tank.14. The cooling system according to claim 1, wherein the heat exchangemember is a condenser.
 15. The cooling system according to claim 1,wherein the first cooling circuit includes two supply lines and tworeturn lines in a reverse-return configuration.
 16. A cooling system,comprising: a central cooling system; a heat exchange assembly coupledto the central cooling system, the heat exchange assembly configured tocool electrical equipment; and a distributed cooling system coupled tothe heat exchange assembly.
 17. The cooling system according to claim16, wherein the central cooling system is a free-cooling system and thedistributed cooling system is a mechanical cooling system.
 18. Thecooling system according to claim 17, wherein the distributed coolingsystem is configured to cool a portion of a heat load associated withthe electrical equipment that exceeds the cooling capacity of thefree-cooling system.
 19. The cooling system according to claim 16,wherein the heat exchange assembly includes a heat exchange member and acooling circuit in thermal communication with the heat exchange member,the cooling circuit further in thermal communication with the electricalequipment.